Ems Inventa Ag

Frank Annighofer

Manfred Hewel

Hans-Joachim Schultze

Annette Lavalette

Ewald Schneider

An adhesive copolyamide composition having a dry powder DSC melting point of at least 100.degree. C., a glass transition temperature above 60.degree. C., a dry powder softening point of at least 100.degree. C., preferably a water content after storage in water of more than 20% by weight, and a wet softening point of less than 100.degree.. Such compositions exhibit softening points and heat resistances in excess of 100.degree. C. and can be processed and set at substantially lower temperatures. No low molecular weight additives are required nor are any solvents necessary. The compositions are comparable in their heat-resistance, softening points, and bond strength to conventional high performance hot melt adhesives.

Adhesive copolyamide composition based on phenylene containing diamine

Heat-resistant, polymer-containing, solvent-free adhesive compositions are prepared by reacting a novel mixture of saturated polyester or copolyester with capped isocyanate under the influence of temperature and, if necessary, catalysts, with evident viscosity increase, with cross-linking as appropriate. The adhesive compositions combine the process-technical properties of low-viscosity melt-adhesives and the strength, tenacity and stability of cross-linked duroplasts or high-viscosity thermoplasts. Subsequent working and protection from explosion are not necessary. Use is possible in each known art for melt-adhesives, e.g. as paste, powder, melt, textiles, or flat structures. In addition, the compositions are suitable as melt coatings or for injection moulding reactions.

Growing community of inventors

Heidenrod, Germany

Frank Annighofer