Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Dcg Systems Gmbh

Carl Zeiss Microscopy Gmbh

Frank Altmann

Christian Schmidt

Herve Deslandes

Rudolf Schlangen

Christian Grosse

Michél Simon

Hilmar Hoffmeister

Detlef Riemer

A non-destructive approach for the 3D localization of buried hot spots in electronic device architectures by use of Lock-in Thermography (LIT). The 3D analysis is based on the principles of thermal wave propagation through different material layers and the resulting phase shift/thermal time delay. With more complex multi level stacked die architectures it is necessary to acquire multiple LIT results at different excitation frequencies for precise hot spot depth localization. Additionally, the use of multiple time-resolved thermal waveforms, measured in a minimized field of view on top of the hot spot location, can be used to speed up the data acquisition. The shape of the resulting waveforms can be analyzed to further increase the detection accuracy and confidence level.

Three-dimensional hot spot localization

A method is described for producing a micro-gripper, which comprises a base body and a gripping body connected integrally to the base body, which projects beyond the base body and provides a receptacle slot on a free end area in such a way that a micrometer-scale or sub-micrometer-scale object may be clamped in the receptacle slot for gripping and holding, as well as a micro-gripper according to the species.

Method for producing a micro-gripper

Growing community of inventors

Halle, Germany

Frank Altmann