Alliedsignal Inc.

Frank A Spicciati

Howard A Fraenkel

Joseph M Ilardi

Bruce E Kurtz

Karen A Davenport

This method relates to a process for manufacturing printed circuit boards in which a metal coating is sputtered onto certain regions of a substrate. Adhesion of the sputtered material is excellent. Surface preparation of the substrate and etching thereof prior to sputtering are virtually eliminated. Films deposited by sputtering exhibit uniform coverage and thickness.

Method for manufacture of multilayer printed circuit boards

This method relates to a process for manufacturing printed circuit boards having high density, fine lines of printed conductors. Extremely straight, vertical walls are formed in the radiation light curable dielectric material.

Method for the manufacture of multilayer printed circuit boards

This invention relates to a process for conditioning the surfaces of natural and synthetic plastic materials for electroless plating of a metal coating thereon exposing such materials to an atmosphere comprising ozone, contacting said exposed materials with a conditioning solvent, such as an aqueous solution of sodium, potassium or lithium hydroxide, contacting said materials with one or more oxidizing acids such as nitric acid and electroless plating of a metal coating on the said material.

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Liverpool, NY, United States of America

Frank A Spicciati