Westinghouse Electric Corporation

Frank A Sattler

Wei-Fang A Su

James R Kwiecinski

George D Dixon

William S Gorton, Jr

Polymeric amide-imide-ester wire enameling compositions are prepared from (1) a monoanhydride of an aromatic tricarboxylic acid, e.g. trimellitic anhydride, (2) an aromatic primary diamine compound and (3) either polyfunctional acids and polyhydroxy compounds or the polyesters thereof. At least a portion of the polyol or polyhydroxy compound is a tris (hydroxyalkyl) isocyanurate, e.g. tris (hydroxyethyl) isocyanurate. The polyfunctional acids (3) comprise an acid component selected from the group consisting of trimellitic anhydride, isophthalic acid and esters of isophthalic and terephthalic acid. The polymeric amide-imide-ester may be blended with terephthalate or isophthalate polyesters, polyisocyanates and other materials. One particularly suitable polyisocyanate is prepared from dimethylterephthalate, tris (2-hydroxyethyl) isocyanurate and tolylene diisocyanate. Small amounts of aliphatic amino compounds, aliphatic polyols and other flexibilizing materials may be incorporated into either the polymeric amide-imide-ester or the polyester blended therewith. A variety of block and modified block polymers may be made. Imidization occurs during the preparation of the polymeric amide-imide-ester so that the condensed water is removed before the fluid compositions are applied and cured.

Amide-imide-ester wire enamels

Disclosed is a UV-curable coating composition and method of preparing it, a method of coating a conductor with it, and the resulting coated conductor. The composition comprises about 20 to about 40% by weight of an acrylated epoxy which is the reaction product of an epoxy resin and an acrylate adduct. The acrylate adduct is the reaction product of an acrylate which may be either 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxyethyl methacrylate or mixture thereof, and either an anhydride or a diisocyanate. The anhydride may be phthalic anhydride, maleic anhydride, trimellitic anhydride, or mixtures thereof. The diisocyanate can be toluene diisocyanate, 4,4'-diisocyanato diphenyl methane, or mixtures thereof. The composition also includes about 4 to about 15% by weight of an acrylated blocked isocyanate which is the reaction product of caprolactam and an acrylated isocyanate. The acrylated isocyanate is the reaction product of an acrylate which can be 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxyethyl methacrylate, or mixtures thereof, with an isocyanate which can be toluene diisocyanate, 4,4'-diisocyanato diphenyl methane, or mixtures thereof. The composition also includes about 45 to about 65% by weight of a mono-acrylate of which at least 60% by weight is phenoxyethyl acrylate, about 5 to about 20% by weight of a polyacrylate of which at least about 50% is triethylene glycol diacrylate, about 2 to about 5% of a photoinitiator, and about 0.05 to about 0.3% by weight of an inhibitor.

UV Curable composition and coil coatings

A tape useful for bonding electrical coils can be made flexible upon cure by using an impregnating varnish composition comprising a blend of (A) an alkyd component reaction mixture containing at least 29 equivalent % of fatty acid, and (B) an alkyl acrylate monomer.

Flexible thermally stable tapes containing a high flash point

Disclosed is a solvent-free wire enamel cement coat which is curable to the B-stage with ultraviolet light. The wire can then be formed into a coil and cured with heat to the C-stage. The cement coat composition comprises a mixture of a UV photosensitizer and a curing agent with either an acrylated epoxy or an amine terminated acrylated epoxy or an acrylated urethane, or mixtures thereof, all dissolved in a monoacrylate. The composition can also include an end-blocked urethane, an acrylated hexamethoxymethyl melamine, or a low molecular weight cresol formaldehyde resin.

Solventless UV cured thermosetting cement coat

Disclosed is a wire enamel blend which is curable to the B-stage with UV light then to the C stage with heat. The blend comprises up to about 40% of an acrylated epoxy dissolved in a monoacrylate, about 2 to about 26% of an acrylated polybutadiene, about 3 to about 26% of an acrylated polyester-amide-imide dissolved in a monoacrylate and in an unsatured diester, about 30 to about 65% of an end-blocked urethane dissolved in a monoacrylate and hydroxy terminated unsaturated diesters, up to about 15% of a cresol formaldehyde dissolved in monoacrylates, about 1.5 to about 5% of a UV photoinitiator, up to about 5% of an acrylated methoxymethyl melamine, and up to about 0.1% of a flow control agent.

Ultraviolet curable solvent-free wire enamel blends

A polyester-amide-imide wire enamel blend is disclosed which is made up of four components--a cross-linkable polyester, a linear polyester, a polyester amide-imide component, and a cresol formaldehyde resin. The cross-linkable polyester is the reaction product of a polyol which is mixture of diol and a triol, a polyfunctional carboxylic compound, and a catalyst. The linear polyester is the reaction product of a diol, a polyfunctional carboxylic compound, and a catalyst. The polyester-amide-imide component is the reaction product of a diamine, trimellitic anhydride, and a polyester which in turn is the reaction product of a polyol, a polyfunctional carboxylic compound, and a catalyst. The cresol formaldehyde resin is the reaction product of a phenol, formaldehyde, and a amine catalyst. All of the four components are in a solution of a carbitol. The polyester-amide-imide wire enamel blend also contains a fatty acid component which may be reacted into any of its polyester components.

High solids polyester-amide-imide wire enamels

A photosensitive, solventless, low viscosity, oil free coating composition is made by admixing: (A) about 40 wt.% to about 90 wt.% of an alkyd component, consisting essentially of a polyhydric alcohol and a dibasic aromatic and aliphatic acid mixture with (B) about 10 wt.% to about 60 wt.% of an acrylate monomer and (C) an effective amount of a photoinitiator; the composition characterized by having a viscosity of up to about 2,000 cps. at 25.degree. C., and being capable of forming an ultraviolet radiation cured, hard, pin hole free film, having a thickness of under about 5 mils.

Photosensitive solventless oil free low viscosity coating composition

A high temperature capability, non-aqueous insulating composition is made by admixing: (A) about 40 wt.% to about 90 wt.% of an alkyd component consisting essentially of: the reaction product of a polyhydric alcohol; a fatty acid or its corresponding monoglyceride; and a dibasic aromatic and aliphatic acid mixture, with (B) about 10 wt.% to about 60 wt.% of an alkyl acrylate monomer having a molecular weight of over about 110; the composition characterized by having a flash point of over 45.degree. C.

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Monroeville, PA, United States of America

Frank A Sattler