Gemalto Sa

François Roussel

Jean-Christophe Fidalgo

Joseph Jerome Leibenguth

Frédérick Seban

Jean-Luc Lesur

Yves Reignoux

Denis Groeninck

Jean-François Martinent

Dorothée Nerot

Denis Vere

Antoine Bajolle

Frédéric Blachon

Laurence Robles

A device having an integrated-circuit chip includes an insulating body containing at least one conductive pad, at least one electrical contact opposite the electrically conductive pad, and at least one recess in the body, including a bottom and one aperture. The recess is connected, at the bottom thereof, to the conductive pad and, at the aperture thereof, to the electrical contact. At least one coil spring is arranged in the recess and connecting the conductive pad to the electrical contact. The installation of the spring in the recess is facilitated by means of the friction of the central portion of the spring relative to the walls of the recess. The invention also relates to a method for producing an electrical connection between at least one conductive pad arranged in an insulating body and at least one electrical contact arranged opposite the electrically conductive pad.

Method for interconnecting a conductive pad and an electrical contact via a spring, and corresponding device

A method for producing a device having a transponder antenna connected to contact pads. An antenna with terminal connections is provided in contact with a substrate. The contact pads are placed on the substrate and connected to the terminal sections of the antenna. The connection is produced by means of a soldering by introducing energy between the pads and the terminal sections. The pads are placed such as to provide a surface facing an antenna terminal connection section. The section is arranged on the substrate and the soldering energy is directly applied to the pads. The invention also relates to the device obtained.

Method for producing a device comprising a transponder antenna connected to contact pads in which soldering energy is applied directly to contact pads

The chip card comprises a card body and an embedded chip module having a plurality of contact fields connected to respective terminals of the chip. The card body further comprises a positioning feature adapted to univocally identify said contact fields according to their location and orientation on the card body. The positioning feature is a hole or a notch formed on the card body in an area including the chip module such as a contact field which has no electrical functionality as contact field Caccording to ISO 7816-2. The invention is particularly adapted to card bodies including a plug-in removable portion of smaller size comprising said chip module and said positioning feature such as smaller size 'mini-plug' SIMs for mobile phones.

Mini-plug SIM card with improved positioning capability

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Auriol, France

François Roussel