Commissariat a L'energie Atomique

Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Thales

Francois Marion

Michel Ravetto

Jean-Louis Pornin

Olivier Gravrand

Manuel Fendler

Michelle Boitel

Lydie Mathieu

Tony Maindron

Damien Saint-Patrice

Marion Volpert

Abdenacer Ait-Mani

Michel Heitzmann

Philippe Rambaud

Alain Gueugnot

Christian Lucas

Baptiste Goubault De Brugiere

Gilles Lasfargues

Jean-Luc Tissot

Bernard Tucek

Jean-Marc DeBono

Stéphane Lagarrigue

This method concerns the protection against humidity of a device including a first and a second electronic components respectively having two opposite surfaces, the surfaces: being separated by a non-zero distance shorter than 10 micrometers; having an area greater than 100 mm; being connected by an assembly of electrical interconnection elements spaced apart from one another by a space void of matter. This method includes applying a deposit of thin atomic layers onto the device to form a layer of mineral material covering at least the interconnection elements, the layer of mineral material having a permeability to water vapor smaller than or equal to 10g/m/day.

Hybrid electronic device protected against humidity and method of protecting a hybrid electronic device against humidity

The invention relates to an assembly method for connecting two electronic components together, said components each having an assembly face, wherein the two assembly faces are moved together in what is known as an assembly direction X, and a given force F is applied to one and/or the other of the components, one and/or the other assembly face(s) having: &#x2014;connection inserts made of rigid material having an elongate longitudinal shape in the assembly direction X; &#x2014;connection tracks made of material having a hardness less than that of the inserts and having an elongate longitudinal shape transversely to the assembly direction X, wherein, in said method: &#x2014;the inserts are aligned opposite corresponding tracks such that the inserts and the tracks form in pairs, after assembly, at least one approximately transverse intersection, &#x2014;the force F is applied so as make the inserts penetrate into the tracks until the assembly is produced.

Assembly method, of the flip-chip type, for connecting two electronic components, assembly obtained by the method

A connecting system having a female element including a hollow flared part for receiving and guiding a male element and a hollow mating part for mating with the male element. A part to be mated of the male element has an outside diameter that before the mating is larger than an inside diameter of the mating part of the female element, and the part to be mated of the male element is made of a material that can be strained and has a corrugated transverse cross section, so as to contract when it is plugged into the mating part of the female element, and/or the mating part of the female connection element is made of a material that can be strained and has a corrugated transverse cross section, so as to dilate when the part to be mated of the male element is plugged into it.

Connecting elements for producing hybrid electronic circuits

The invention relates to a method for making a connection component that comprises a set of conducting inserts to be electrically connected with another component, said inserts being hollow.

Method of making a connection component with hollow inserts

The invention relates to a system and method for positioning and passively aligning at least one optical component as close as possible to an electromagnetic radiation detector. This system comprises supporting wedges () for Z positioning of the optical component () as close as possible to the detector () and passive X and Y alignment means via holding wedges and/or holding balls (), the X, Y and Z axes being axes perpendicular to each other.

Detector system with an optical function and method for making such a system

A method for manufacturing a microelectronic assembly including stacked first and second microelectronic components having a cavity therebetween including defining said cavity by means of a lateral wall forming a closed frame extending around a determined area of the first component except for an opening used as a vent; forming within the closed frame and opposite to the vent an obstacle capable of forming, in cooperation with the lateral wall, a bypass duct for the filling material; performing a flip-chip hybridization of the first and second components, a surface of the second component resting on the upper edge or end of the lateral wall formed on the first component to form said at least one cavity; injecting the filling material in liquid form between the two hybridized components to embed said at least one cavity and to make it tight by obstruction of the vent as said filling material solidifies.

Method of flip-chip hybridization for the forming of tight cavities and systems obtained by such a method

A method for bonding two electronic components includes inserting hollow and open inserts into full convex elements of a lower hardness than that of the inserts, where, when an insert is inserted into a full element at least one surface of the open end of the insert is left free from the full element so as to create an outlet passage for gases contained in the insert.

Method for bonding two electronic components

This metal lip seal capable of ensuring tightness between two elements includes: two resilient members each intended to be accommodated in a cavity of one of the two elements, said cavities being located in line with a zone of engagement of the two elements one with the other in which tightness is desired; and a flexible body secured to the element receiving the resilient members, provided with two free ends, said free ends extending at least in line with said engagement zones and being in contact with the resilient members. Each of the resilient members is capable of exerting a contact force on the free ends in order to ensure tightness between the two elements.

Metal lip seal and machine fitted with same seal

The invention relates to a method of thinning a block transferred to a substrate. According to the invention, the method includes depositing a stop layer at least onto the substrate and in a way adjacent to and contiguous with the transferred block. The stop layer is made out of material of greater resistance or hardness than the material of the transferred block and of smaller thickness than that of the transferred block. The method further includes actuating the thinning of the transferred block. The thinning time is pre-programmed as a function of a predetermined speed of thinning the transferred block, the thinning time being selected so that the thinning also attacks the stop layer.

Method of thinning a block transferred to a substrate

The invention relates to a method for producing a matrix of electronic components, comprising a step of producing an active layer on a substrate, and a step of individualizing the components by forming trenches in the active layer at least until the substrate emerges. The method comprises steps of depositing a layer of functional material on the active layer, depositing a photosensitive resin on the layer of material in such a way as to fill said trenches and to form a thin film on the upper face of the components, at least partially exposing the resin to radiation while underexposing the portion of resin in the trenches, developing the resin in such a way as to remove the properly exposed portion thereof, removing the functional material layer portion that shows through after the development step, and removing the remaining portion of resin.

Method for producing a matrix of individual electronic components and matrix produced thereby

A method for soldering or hybridizing two components including preparing, on opposing surfaces of the components to be welded or hybridized, a wettability surface, depositing on one of the wettability surfaces an appropriate quantity of solder material, constituting a soldering or hybridizing dot, contacting the wettability surfaces of the components with the solder material deposited, then raising the temperature of the chamber in which the components are positioned, to at least the melting point of the solder material in order to ensure the effective soldering or hybridizing of the two components together by a remelt effect. At least one of the components is in contact with a conducting track having another quantity of solder material that constitutes a sacrificial dot, having a contact area with the at least one component that is higher than that of the solder quantity that constitutes the soldering or hybridizing dot.

Method for soldering two elements together using a solder material

A connection device between two components includes a hollow conductive insert, into which is fitted another conductive insert, the electrical connection between the two inserts being provided by means of a solder element.

Connection by fitting together two soldered inserts

The hybridization method provides a first component with first pads and a second component with second pads for accommodating protrusions of a fusible material, so that the first pads and second pads line up two by two in order to form pairs of pads to interconnect the two components when aligned. Then placing the first and second components one on top of the other to form an assembly where some of the protrusions of fusible material on the first and/or second pads respectively consist of at least three larger-sized protrusions, especially taller protrusions, so that before the temperature is increased to the hybridization temperature of the fusible material, the component only rests on the larger protrusions.

Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method

A method of sealing or welding two elements to one another in a chamber under vacuum or controlled atmosphere. The method comprises steps consisting of: producing a wettability area on opposing faces of the elements to be welded, with one of the areas comprising a layer of gold and having a surface area greater than the surface area of the other wettability area; depositing a quantity of suitable sealing material comprising indium on one of the areas; bringing the wettability area of the other element into contact with the material thus deposited; and raising the temperature of the chamber containing the elements to be welded or sealed to at least 250&#xb0; C. in a non-oxidizing atmosphere, in order to seal the two elements effectively to one another by means of remelting.

Growing community of inventors

Saint Martin le Vinoux, France

Francois Marion