Ipdia

Francois Lecornec

Johan Hendrik Klootwijk

Freddy Roozeboom

Fabrice Verjus

Lionel Guiraud

David D R Chevrie

Nicolaas J A Van Veen

Jean-Marc Yan-Nou

David Chevrie

Olivier Tesson

The invention relates to an electric device including an electric element, the electric element comprising a first electrode () having a first surface () and a pillar (), the pillar extending from the first surface in a first direction (), the pillar having a length measured from the first surface parallel to the first direction, the pillar having a cross section () perpendicular to the first direction and the pillar having a sidewall surface () enclosing the pillar and extending in the first direction, characterized in&#x2014;that, the pillar comprises any one of a score () and protrusion () extending along at least part of the length of the pillar for giving the pillar () improved mechanical stability. The electrode allows electrical elements such as capacitors, energy storage devices or diodes to be made with improved properties in a cost effective way.

Electronic device having electrode with high area density and improved mechanical stability

A device substrate has a device major surface, a semiconductor element on the device major surface, and electrically conductive device connectors extending across the device major surface. An interconnection substrate has an interconnection substrate having an interconnection major surface, the interconnection substrate defining at least one sealing recess recessed from the interconnection major surface, the sealing recess being surrounded by a sealing ring. The device substrate is mounted on the interconnection substrate with the interconnection major surface facing the device major surface, the sealing ring around the semiconductor element and with the device major surface sealed against the sealing ring so that the recess forms a sealed cavity containing the semiconductor element. Electrical interconnects extend across the interconnection major surface. Interconnection bumps are provided outside the sealing ring to electrically connect the device to the interconnect substrate.

Integrated package

Growing community of inventors

Luc sur Mer, France

Francois Lecornec