International Business Machines Corporation

Jds Uniphase Corporation

Applied Micro Circuits Corporation

Francois Guindon

Paul Francis Fortier

Benson Chan

John Henry Sherman

Glen Walden Johnson

Real Joseph Tetreault

Martial A Letourneau

Paul Andrew Moskowitz

Michael John Brady

Gerald Daniel Malagrino, Jr

James Robert Moon

Ladd William Freitag

Philip Murphy

Gary T Galli

Joseph Paul Kuczynski

Pedro A Chalco

David R Motschman

James Earl Olson

Jean-Marc Papillon

Steven Jeffrey Martin

Michel Fleury

Normand Gilles Favreau

A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

Assembly of opto-electronic module with improved heat sink

A substrate interface system and method are provided for connecting a coplanar waveguide transmission line to a coaxial connector. The system comprises a substrate having a top surface with a coplanar waveguide having a transmission line interposed between coplanar groundplanes. A housing wall assembly has an aperture and an interior surface adjacent the substrate coplanar waveguide. A coaxial connector, mounted in the housing wall assembly through the aperture, has a center conductor connected to the coplanar waveguide transmission line and a ground connected to the housing wall assembly. Extensions are mounted on the wall assembly interior surface, connected to the coplanar waveguide groundplanes. The substrate need not be grounded to the coaxial connector through a substrate bottom surface groundplane/chassis interface. The substrate can include signal trace layers underlying the top surface, and vias proximate to the wall assembly extensions are formed between the coplanar waveguide groundplane and underlying ground layers.

System and method for interfacing a coaxial connector to a coplanar waveguide substrate

An optical transceiver arrangement includes a retainer assembly. The retainer assembly includes at least one housing adapted to be coupled to a fiber optic cable, and at least one carrier assembly having a carrier, and a die chip attached to the carrier. The die chip has at least one active region. The optical transceiver arrangement further includes at least one optical coupler disposed within the housing for optically coupling the at least one active region to the fiber optic cable. The optical transceiver arrangement also includes a laminate assembly having the retainer assembly disposed thereon. The die chip is electrically coupled to the laminate assembly.

Enhanced optical transceiver arrangement

Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.

Alignment systems for subassemblies of overmolded optoelectronic modules

A plug which has a plugging portion and a stem extending therefrom is formed of an elastomeric material in order to deform to create a wiping engagement and a seal with the walls of a receiving cavity. The stem and plugging portion include both cavities for receiving alignment pins in the device being plugged and a manually engageable portion on a distal end of the stem for removing the plug from the sealed cavity, such as within an optical subassembly module. The side edges of the plugging member conform to the cavity cross-section to enhance the sealing yet do not unduly deform the member. The sealing member is formed with one or more standoffs to engage an end face of the cavity, assuring no contact between the optical elements and the plug. The edges of the plug deform upon insertion to create the seal and form a wiping engagement with the cavity interior.

Processing protective plug insert for optical modules

A heat sink for a transceiver optoelectronic module including dual direct heat paths and structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

Manufacturing of a novel thin and flexible radio frequency (RF) tag with a stamped metal leadframe antenna is disclosed. The tag is made by transporting a leadframe strip having leadframe antenna 'cutouts' to a point where a chip is mechanically and electrically attached directly to the leadframe antenna. A battery can be attached to the chip in the process. Processes to cut support bars holding the leadframe antenna to the leadframe strip, seal the package (by lamination or molding), and to excise the sealed component are performed in various orders to produce a final product. Intermediate support (positioners) for the thin leadframe are optionally provided add structural support to the antenna while the sealed component is made. A protective surround can be added to cover the package and to provide further structural support for the package while still permitting the sealed component to be thin and flexible.

Method of making a thin radio frequency transponder

A novel radio frequency transponder (tag) with a minimum of components and connects is thin and flexible because these components and connects can be unsupported by a substrate layer. This is accomplished by using a conducting leadframe structure not only as a connection medium but also as a circuit element, i.e., the transponder antenna. In various preferred embodiments, the leadframe is mechanically positioned and fixably attached to a circuit chip so that the leadframe (antenna) is self supporting. A protective coating can be added where the leadframe is attached to the circuit chip. Further a protective surrounding can envelops the entire leadframe antenna, circuit chip, and, if provided, the protective coating.

Thin radio frequency transponder with leadframe antenna structure

Growing community of inventors

Stukely-sud, Canada

Francois Guindon