Commissariat a L'energie Atomique

Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Francois Baleras

Jean-Charles Souriau

David Henry

Yves Fouillet

Christophe Martinez

Jean-Louis Pornin

Christophe Kopp

Vincent Agache

Elisabeth Delevoye

Charlotte Gillot

Pierre Blondy

Sandrine Maubert

Martine Cochet

The invention is a process for producing an electromechanical device including a movable portion that is able to deform with respect to a fixed portion. The process implements steps based on fabrication microtechnologies, applied to a substrate including an upper layer, an intermediate layer and a lower layer. These steps are:

Process for producing an electromechanical device

A method for producing at least one deformable membrane micropump including a first substrate and a second substrate assembled together, the first substrate including at least one cavity and the second substrate including at least one deformable membrane arranged facing the cavity. In the method: the cavity is produced in the first substrate; then the first and second substrates are assembled together; then the deformable membrane is produced in the second substrate.

Method for producing at least one deformable membrane micropump and deformable membrane micropump

An electronic device with integrated discrete components, including a wafer including cavities that can receive the components, an active face of the components being in a same plane as a face of the receiving wafer, and a material for laterally coating the components in the cavities.

Integrated multicomponent device in a semiconducting die

A method of producing an electronic connection device, including: a) formation, in a plane of a support substrate, of at least one first contact element and, in a direction approximately perpendicular to the plane, of at least one second contact element having a first end in electrical contact with the first contact element or elements and a second end, the second contact element or elements including one or more metal tracks standing up along the direction perpendicular to the surface of the substrate; b) then positioning at least one electrical or electronic component in contact with the first contact element or elements; and c) encapsulation of the component(s) and of the first and second contact elements, at least the second end or ends of the second contact element or elements being flush with the surface of the encapsulating material.

Method of producing a via in a reconstituted substrate

A method for installing a sorption element in a cavity including: disposing, within the cavity, a getter material, a reaction material, and a protective material, the protective material covering at least one part of the getter material so as to bury the at least one part; raising a temperature up to at least one removal temperature; and moving the protective material towards the reaction material by reaction between the protective material and the reaction material so that at least one portion of the part of the getter material is no longer covered with the protective material.

Thin film getter protection

The invention relates to an encapsulated microcomponent having a cover () delimiting a sealed cavity () equipped with at least one orifice () provided with a plug (). The plug () comprises a getter material portion () exposed inside the cavity (). Application in particular in MEMS.

Encapsulated microcomponent equipped with at least one getter

This assembly of an object and a support is achieved by using solder bumps. At least two wettability areas are made respectively on an object and on a support. Each solder bump ensures electrical contact and mechanical fixing firstly to one of the wettability areas of object and secondly to one of the wettability areas of support. The melting temperature of solder bumps is lower than the melting temperature of each of the wettability areas. Each wettability area of the object forms an angle of 70&#xb0; to 110&#xb0; with respect to each wettability area of the support and the object and the support are mutually distant from one another.

Assembly and method of assembling by soldering an object and a support

The invention relates to a frequency filter including a structure with, on one face, two extreme evanescent areas and at least one wave guide area between the evanescent areas. The at least one wave guide area and the evanescent areas form a single closed cavity. The single cavity is partitioned by at least two resonator elements that are embedded in the single cavity at placement areas and that contribute to delimiting the at least one wave guide area and the evanescent areas.

Growing community of inventors

Saint Georges de Commiers, France

Francois Baleras