Broadcom Corporation

University of California

Movandi Corporation

Samsung Electronics Co., Ltd.

Silicon Valley Bank

Franco De Flaviis

Seunghwan Yoon

Ahmadreza Rofougaran

Maryam Rofougaran

Jesus Alfonso Castaneda

Alfred Grau Besoli

Michael Boers

Sam Gharavi

Farid Shirinfar

Stephen Wu

Kartik Sridharan

Nicolaos Georgiou Alexopoulos

Donghyup Shin

Zhihui Wang

Mark Bachman

Guann-Pyng Li

Amin Shameli

Bedri A Cetiner

Jiangyuan Qian

Hung-Pin Chang

Young-Eil Kim

Thomas Francis Baker

Enver Adas

Chang-won Jung

Aminghasem Safarian

Hyoung-Woon Park

Filippo Capolino

S Ali Hosseini

Fatemeh Fazel

Hamid Jafakhani

An antenna module that includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, a plurality of packaged circuitry on a second surface of the antenna substrate, and a plurality of supporting balls mounted on the second surface of the antenna substrate. The plurality of packaged circuitry includes a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate. Each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, where at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs.

Three dimensional antenna array module

An apparatus includes a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each of the plurality of antenna modules is mounted on a plurality of portions of the heat sink such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the plurality of portions of the heat sink embedded within the plurality of holes.

Provided is an apparatus including a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.

An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.

Three-dimensional antenna array module

A multifunctional electromagnetic structure is presently disclosed. Said structure is a true electromagnetic bandgap ('EBG') material, with both surface and leaky waves suppressed from the whole structure along all lateral directions. It is also an antenna element, configured to radiate to the broadside direction. The structure has two metallization layers of concentric rings between a square-shaped radiating top metal layer and a bottom ground plane. The lower concentric ring is connected to the ground plane through a plurality of vias, while the patch of the top metal layer is fed with a probe. The EBG unit cells may be used as antenna elements in a phased array environment, where they eliminate scan blindness from the array structure along all scan directions.

Integrated antennas and phased arrays with mode-free electromagnetic bandgap materials

A phased array antenna panel includes an array of antenna cells. Optionally, the phased array antenna panel includes a frame with multiple shielding fences housing the array of antenna cells. Each antenna cell includes a raised antenna patch with air dielectric. In one example, the raised antenna patch may include four projections having outwardly increasing widths, and four supporting legs, each of the four supporting legs situated between a pair of adjacent projections. A first differential feed port may be coupled to first and second supporting legs of the raised antenna patch through first and second transformers, and a second differential feed port may be coupled to third and fourth supporting legs of the raised antenna patch through third and fourth transformers. A return loss in a frequency range of between 27.5 GHz and 29.5 GHz of each antenna cell is less than about &#x2212;10 dB.

Raised antenna patches with air dielectrics for use in large scale integration of phased array antenna panels

A near field RFID system includes an RFID reader and an RFID tag. The RFID reader includes a transmit path and a receive path, wherein the transmit path includes: an encoding section coupled to convert data into encoded data; a digital to analog conversion module coupled to convert the encoded data into an analog encoded signal; a power amplifier coupled to amplify the analog encoded signal; and a plurality of coils coupled to generate a plurality of electromagnetic fields from the analog encoded signal. The RFID tag that includes: a coil coupled to generate a current and a recovered signal from at least one of the plurality of electromagnetic fields; a power recovery circuit coupled to generate a voltage from the current; and a data processing section coupled to process the recovered signal, wherein the data processing section is powered via the voltage.

Near field RFID system with multiple reader coils

Aspects of a method and system for a wireless integrated power test and measurement are provided. In this regard, concurrently with receiving a first signal via a first antenna, a second signal that indicates received signal strength of the first signal may be generated and transmitted via a second antenna. The second signal may be utilized to determine performance of the first antenna. A frequency of the generated second signal may be controlled so as to mitigate interference between the transmitted second signal and the received first signal. The first signal may be formatted in accordance with one or more first wireless standards and the second signal may be formatted in accordance with one or more second wireless standards. The received signal strength of the first signal may be determined via an analog-to-digital converter and the second signal may be updated at the sample rate of the analog-to-digital converter.

Method and system for a wireless integrated test and measurement device

An apparatus, system, and/or method for a single planar feeding structure or antenna that may be integrated with one or more other system blocks is provided. The antenna may provide high radiation gain due to a large number of the radiating elements, which may be represented by one or more periodic openings or slots in a partially reflective surface (PRS). A feed network for the antenna may be provided by a wave bouncing between a ground plane and the PRS. The feed may be substantially in air, thereby suffering little to no loss. The fabrication process and/or method for the antenna is simple and low-cost. In one embodiment, the antenna may be formed at least in part by micromachining. The antenna may be designed at least in part using the Fabry-P&#xe9;rot Cavity (FPC) method.

Low-cost high-gain planar antenna using a metallic mesh cap for millimeter-wave freqeuncy thereof

Space-Time-State Block Coded MIMO communication system using reconfigurable antennas. One or more antennas are operates in accordance with a Space-Time-State Block Code (STS-BC) to effectuate channel coding of a signal being transmitted wirelessly between communication devices. In accordance with such an STS-BC, one or more antennas (being reconfigurable in nature) of a communication device are reconfigured in different radiation states. From some perspectives, this may be viewed as performing three-dimensional channel coding, in that, in addition to achieving at least time diversity of signals being transmitted (and also potentially including spatial diversity), state diversity may be achieved by adapting one or more characteristics of one or more antennas within the communication device. Such an STS-BC may operate in an open loop configuration without requiring any feedback from another communication device to which signals are transmitted. If desired, feedback may be employed for adaptively modifying an STS-BC (or selecting another STS-BC).

Space-time-state block coded MIMO communication system using reconfigurable antennas

An RF transceiver front-end includes receiver and transmitter front-ends. The receiver front-end includes 1and 2antennas, a ninety degree phase shift module and an LNA module. The 1and 2antennas receive inbound RF signals and provide a first directional circular polarization. The ninety degree phase shift module phase shifts the RF signals received by the 2antenna. The LNA module amplifies the RF signals received by the 1antenna and the shifted RF signals. The transmitter front-end includes a PA module and 3and 4antennas, which provide a second directional circular polarization. The PA module amplifies outbound RF signals to produce amplified outbound RF signals and amplified orthogonal outbound RF signals. The 3antenna transmits the amplified outbound RF signals and the 4antenna transmits the amplified orthogonal outbound RF signals.

RF transceiver front-end

An antenna structure includes first and second antennas. The first antenna has a first geometry corresponding to a first frequency. The second antenna has a second geometry corresponding to a second frequency. The second antenna is proximal to the first antenna and utilizes electrical-magnetic properties of the first antenna to transceive signals at the second frequency.

Multiple mode RF transceiver and antenna structure

A planer antenna structure includes a first planer antenna and a second planer antenna. The first planer antenna has a first axial orientation and a conductive antenna pattern on a first surface of a supporting substrate. The second planer antenna has a second axial orientation and the conductive antenna pattern on the first surface of the supporting substrate.

Growing community of inventors

Irvine, CA, United States of America

Franco De Flaviis