Fico B.v.

Franciscus Bernardus Antonius De Vries

Wilhelmus Gerardus Jozef Gal

Hendrikus Johannes Bernardus Peters

Johannes Lambertus Gerardus Marla Venrooij

Arthur Theodorus Johannes Reijmer

The invention relates to a method for encapsulating electronic components in a mold by the processing steps of: A) placing the electronic component for encapsulating in a mold cavity, and B) feeding an encapsulating material to the mold cavity, wherein at least a part of the mold surface defining the mold cavity is brought into contact with a conditioning gas containing a decreased oxygen concentration relative to the atmosphere. The invention also relates to a device for encapsulating an electronic component, in particular a semiconductor, with encapsulating material.

Method and device for encapsulating electronic components with a conditioning gas

The invention relates to a method for encapsulating an electronic component, in particular a semiconductor, fixed on a carrier, comprising the processing steps of: a) placing at least one foil layer in a mould, b) placing the carrier in contact with the foil layer with the side remote from the component, and c) encapsulating the electronic component with encapsulating material, wherein the foil layer undergoes a treatment whereby the adhesion of the foil layer is increased such that it adheres to the carrier. The invention also relates to a foil material for applying during such a method.

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Eibergen, Netherlands

Franciscus Bernardus Antonius De Vries