Motorola Corporation

Francisco D Alves

Kingshuk Banerji

Kenneth R Thompson

Robert F Darveaux

Epoxy bonding between an IC chip and a chip carrier is strengthened by creating substantially rougher oxidized surfaces within substantially smooth gold surfaces of a die paddle portion of the chip carrier.

Chip carrier for an integrated circuit assembly

A method of attaching an integrated circuit (10) to a substrate (20) starts with electrically interconnecting (14) the integrated circuit on the substrate. Next, a bead of underfill material (22) is provided on the substrate (20) about the periphery (24) of the integrated circuit (10). At least a partial vacuum (34) is then applied to the integrated circuit (10) and the substrate (20) to substantially evacuate the area (18) between the integrated circuit (10) and the substrate (20). Finally, fluid pressure (42) is applied to the integrated circuit (10) and the substrate (20) to force at least a portion of the underfill material (22) into the area (18) between the integrated circuit (10) and the substrate (20).

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Boca Raton, FL, United States of America

Francisco D Alves