International Business Machines Corporation

Francis W Bogaczyk

Michael A Rubsam

Darryl Ray Polk

Gregory E Beers

Billy D Purcell

David P Watson

Terry L Wilmoth

Edward E Toutant

Henry E Wattenbarger

Gilbert B Nebgen

Joel R Anstrom

Robert W Kulterman

Clifford M Wood

Robert A Amos

Richard C Croll

The method and apparatus of the present invention permit the visual inspection of electronic component leads during the mounting thereof. A hot bar thermode or other mounting tool is provided having a plurality of thermally activatable blades. A vacuum chuck and associated vacuum pump are utilized to selectively mount an integrated circuit device such that the conductive leads of the device are disposed adjacent to the lower surfaces of the thermally activatable blades. A low angle light source is then utilized to illuminate the integrated circuit device conductive leads such that a high contrast is created between the conductive leads and the lower surface of the thermally activatable blades, in order to permit an accurate visual inspection of the conductive leads. In one embodiment of the present invention, the lower surfaces of the thermally activatable blades are given a uniform grain by lapping those surfaces in a single direction to minimize the specularity of these surfaces and the angle of illumination is adjusted to enhance the contrast between the conductive leads and the lower blade surfaces. A camera disposed below the hot bar thermode may then be utilized to permit remote visual inspection of the conductive leads of an integrated circuit device while it is present within the mounting tool.

Method and apparatus for electronic component lead inspection

The apparatus of the present invention may be utilized for the automated bonding of electronic components to a circuit board. A placement and bonding head is attached to a manipulatable robotic arm and is utilized to select an electronic component having a plurality of conductive leads from a supply of such components and position that component adjacent a plurality of contact pads on a circuit board. While retaining the electronic component within the placement and bonding head, the component is then thermally bonded to the contact pads. In one embodiment of the present invention, an electronic component may be optically inspected while being retained within the placement and bonding head. In another embodiment, thermal bonding is accomplished utilizing a plurality of thermally activatable blades which each include a thermocouple mounted adjacent thereto. Selective low current control signals are then coupled to the placement and bonding head where transformers are utilized to amplify the current prior to coupling the control signal to individually thermally activatable blades. In yet another embodiment of the present invention, the placement and bonding head includes a plenum for supplying inert gas to the bonding site so that the use of flux is not necessary.

System for automated mounting of electronic components to circuit boards

A ribbon cartridge comprising a cartridge housing having take-up and supply reels rotatably mounted in the housing; each reel supports a portion of a ribbon web running in a path from the supply to the take-up reel in combination with a ribbon stuffer box disposed along the path of the ribbon between the supply and take-up reel whereby the ribbon running between these two reels passes through the stuffer box.

Ribbon cartridge comprising a stuffer box intermediate a supply reel and

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Austin, TX, United States of America

Francis W Bogaczyk