Memc Electronic Materials, Inc.

Francis Richard Bronson

Richard William Heim

Kenneth Abraham Frank

Roger Paul Durkee

Wafer demount apparatus automatically demounts and transports a polished semiconductor wafer to an inspection station. The apparatus includes a bridge located between a polishing block supporting wax-mounted wafers and an offload conveyor. The bridge fills the gap and provides a smooth transition surface for the wafers moving from the polishing block to the conveyor. The bridge is also capable of movement to achieve vertical and horizontal alignment with the polishing block.

Wafer demount apparatus

A method for mounting a semiconductor wafer on a polishing block to hold the semiconductor wafer during polishing. The method comprises the steps of providing a polishing block having a surface for mounting the semiconductor wafer and providing a heater comprising a heater body and a thermally conductive buffer plate which is selectively moveable with respect to the heater body between a pre-heating position in which the plate is spaced from the heater body and a heating position in which the plate contacts the heater body. A bonding agent is applied to the polishing block surface. The polishing block is placed on the buffer plate when the buffer plate is positioned in the pre-heating position and the buffer plate is moved from the pre-heating position to the heating position to heat the buffer plate, the polishing block and the bonding agent. The buffer plate is held in the heating position with the polishing block on the buffer plate for a period of time sufficient to prepare the bonding agent and the semiconductor wafer is applied to the prepared bonding agent.

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High Ridge, MO, United States of America

Francis Richard Bronson