Future Wei Technologies, Inc.

Compertum Microsystems Inc.

Aceinna, Inc.

Francis Piu Man

Ming Li

Dongyu Geng

Xin Tu

Jianmin Gong

Peng Zhang

Yang Zhao

YuSheng Bai

Zhengxin Zhao

Jiejiang Xing

Ohlan Silpachai

A MEMS micro-mirror device includes a middle substrate, a movable structure, at least one stopper coupled with the movable structure, at least one flexure, an upper cap, and a lower cap. The movable structure includes a micro-mirror plate having a reflective surface. The flexure connects the stopper and the middle substrate. The upper cap, bonded with the middle substrate, has a first opening for allowing the movable structure's movement and has at least one first recess facing a first side of the flexure and a first side of the stopper. The lower cap, bonded with the middle substrate, has a second opening for allowing space for the movement and has at least one second recess facing a second side of the flexure and a second side of the stopper.

MEMS micro-mirror device with stopper and method of making same

A depth thermal imaging module, including a thermal imager array, which includes a plurality of at least two thermal imagers that capture thermal radiation of a wavelength of a scene from different viewpoints. Each thermal imager includes a thermal imager chip, a lens stack, and a focal plane with focal length f. The thermal imagers are separated by a baseline distance of 2h and depth measurement Z is performed on an object of interest based on Z=2hf/&#x394; where &#x394; is the difference in location of the object of interest between its location in the thermal image captured by a first thermal imager and the location of the object of interest in the thermal image captured by a second thermal imager and represents as an offset of the point on the focal plane of the first thermal imager and the second thermal imagers relative to their optical axis.

System and method for depth thermal imaging module

Optical cross connects and methods for use therewith are described herein. In an embodiment, an optical cross connect includes first and second mirror arrays, first and second light sources that respectively emit first and second color coded light beams (e.g., each of which includes red, green and blue light), and first and second cameras configured to respectively capture first and second color images of the first and second color coded light beams reflected respectively from the first and second mirror arrays. The optical cross connect also includes a controller configured to perform closed loop feedback control of the first and second mirror arrays, based on the first and second color images, when the controller controls how optical signals are transferred between individual optical fibers in a first bundle of optical fibers and individual optical fibers in a second bundle of optical fibers.

Optical cross connects including mirror monitoring

A MEMS package includes a cavity formed within a package body, a semiconductor device disposed within the cavity and including a microelectromechanical systems (MEMS) micro-mirror, a damping fluid disposed within the cavity and at least partially surrounding a portion of the MEMS micro-mirror, and a magnet assembly disposed within the cavity and at least partially surrounded by the damping fluid, the magnet assembly being magnetically coupled with the MEMS micro-mirror.

Electromagnetic activated mirror array with fluid damping and micro-fabricated recess for magnet assembly

Methods and apparatus for reducing the oscillation of a MEMS actuator. In one embodiment, a driving signal is generated to adjust the MEMS actuator through a set of driving wires coupled to the MEMS actuator. A motion-induced signal from the set of driving wires coupled to the MEMS actuator is received in response to the driving signal. The motion-induced signal is filtered to generate a filtered motion-induced signal. The filtered motion-induced signal is amplified to generate an amplified filtered motion-induced signal. The driving signal is adjusted based on the amplified filtered motion-induced signal to reduce the oscillation of the MEMS actuator.

Active MEMS damping

A MEMS flow sensor is provided having a micro flow channel etched in a silicon structure composed of two silicon substrates bonded or fused together. A heater and one or more temperature sensors are, in one embodiment, disposed around the perimeter of the flow channel and outside of the channel. In another embodiment, a heater and one or more temperature sensors are respectively disposed outside the flow channel at the top and bottom of the channel. In further embodiments, a heater and one or more temperature sensors are located inside the flow channel on one or more surfaces thereof or around the inside perimeter of the channel. The flow sensors in accordance with the invention are preferably fabricated using wafer scale fabrication techniques.

Growing community of inventors

Lexington, MA, United States of America

Francis Piu Man