US Government as Represented by the Secretary of the Army

Francis J Murdoch

Owen P Layden

An arrangement and method for mounting IC chips or dice onto substrates crises the use of (a pair of) electrically conductive electrodes placed on a substrate below the location where the IC chip is to be mounted. The electrodes are separated a distance that is approximately equal to the width of the IC chip to be mounted. A resistor material is disposed between the electrodes, or may even be integral therewith. The IC chip is placed above the resistor material, it is insulated from the latter, and it abuts a layer of bonding material (e.g., eutectic solder or epoxy) on its underside. A voltage applied to the electrodes heats the resistor material which, in turn melts or cures the bonding material to thereby secure the IC chip in place on the substrate.

Non-destructive semiconductor chip bonding and chip removal

A mechanical acceleration multiplier for testing the bond strength of an adhesive wherein the adhesive to be tested is subjected to a centrifugal force.

Mechanical acceleration multiplier for microcircuit bond testing

A very-fine microcircuit interconnecting wire is passed through a central ifice in a capillary bonding head of a thermo-compression device which is used for pressing the balled end, or the body, of the microcircuit interconnecting wire to the metallized pads of a hybrid circuit chip. A pair of capillary tubes are moveably attached to the capillary bonding head in such a way that they can be positioned with their orifices opposing each other on opposite sides of the very fine wire just below the central orifice of the capillary bonding head. An insulating adhesive or enamel is passed through the capillary tubes to blend around the wire and form an insulating layer as the capillary bonding head is moved from one bonding point to the next.

Growing community of inventors

Monmouth Beach, NJ, United States of America

Francis J Murdoch