Honeywell G.m.b.h.

Francis J Belcourt

Richard K Spielberger

Thomas J Dunaway

Lori A Dicks

Martin J Van Dyke

Jerald M Loy

Disclosed is a stacked leadframe assembly for use with integrated circuit chips. The assembly comprises multiple leadframes arranged in stacked relation. Each leadframe comprises conductive elements and solder bumps for electrically and mechanically connecting selected conductive elements of the leadframes.

Stacked tab leadframe assembly

Two condition sensors of two entirely different types are selected and monitored by a single condition sensor interface means. The interface means provides for selection of the sensor to be activated, or can be operated in a mode to repetitively sample both sensors. The sensors rely on a hybrid type device utilizing an integrated circuit, discrete components, and a mounting substrate. The sensors may be mounted on the substrate for temperature stability.

Growing community of inventors

Bloomington, MN, United States of America

Francis J Belcourt