Hewlett-packard Company

Koninklijke Philips Corporation N.v.

Agilent Technologies, Inc.

Francis E Gurrie

Wojtek Sudol

Walter Patrick Kelly, Jr

Rodney J Solomon

David P Dolan

Alec Rooney

Larry A Ladd

An acoustic backing element includes a glass fiber epoxy composite planar substrate to the outer major surfaces of which are applied electrically conductive material. The electrically conductive material may be a conductive layer that is etched to expose electrical contact material in the form of conductive traces. Each conductive trace provides electrical connection between a transducer element and electrical control circuitry typically located on an electrical circuit board. The acoustic backing element provides precisely located electrical contacts for connecting the transducer elements to their control circuitry, while simultaneously providing superior acoustic attenuation. In addition, the thermal coefficient of expansion (TCE) of the glass fiber epoxy composite material comprising the planar substrate can be closely matched to the TCE of the electrical contact material. In this manner, fatigue and failure caused by mechanical stresses between the planar substrate and the electrical contact material due to temperature extremes and temperature cycling are significantly reduced.

Ultrasonic transducer backing assembly and methods for making same

A method for constructing a connection assembly for use in a multiple aperture ultrasonic tranducer including an array of elements for transmitting or receiving signals, wherein each element is comprised of a plurality of segments, and the connection assembly for interconnecting the segments of each elements and for connecting the segments to transmit/receive circuitsto form the aperatures of the array. An isolating layer is superimposed on the segments of the array and a plurality of via openings are formed through the isolating layer. At least one via opening being assocated with each segment of the array and each via opening exposing an area of an assocated segment. A conductive layer is superimposed on the isolating layer, the conductive layer having conduxtive paths interconnecting the segments and connecting the segments to the transmit/receive circuits to form the apertures of the array.

Method of constructing segmented connections for multiple elevation transducers

An ultrasound transducer connector for connecting a transducer to a terminal on an ultrasound unit, the ultrasound transducer connector including a shell; a LIF connector supported by the shell; and a cable electrically connected to the LIF connector that electrically connects the LIF connector to the transducer.

Ultrasound transducer connector assembly

An ultrasound transducer connector assembly including a low insertion force connector, a leaf spring latch and several alternative housing configurations.

A connection assembly for use in a multiple aperture ultrasonic transducer including an array of elements for transmitting and receiving wherein each element includes a plurality of segments and the connection assembly interconnects the segments of the elements and the segments to transmit/receive circuits to form the apertures of the array. The connection assembly includes an isolating layer superimposed on the segments with at least one via opening located within the area of each segment and a conductive layer superimposed on the isolating layer with conductive paths interconnecting the segments and the segments to the transmit/receive circuits to form the apertures of the array. The conductive layer forms a continuous layer covering the isolating layer, the interior surfaces of the via openings and the areas of the segments exposed through the via openings and is scribed to divide the conductive layer into the conductive paths. The conductive paths associated with each element are separated from the conductive paths associated with neighboring elements by the dicing cuts that divide the elements and segments from one another. A flex circuit is assembled coplanar with the segments and the isolating and conductive layers are superimposed on the elements and flex circuit so that the connections between the segments and flex leads are accomplished by the same processes.

Segment connections for multiple elevation transducers

An acoustic transducer includes a support structure which holds an acoustic pulse generator having both a front application face and a rear face. An acoustic absorber is attached to the rear face of the pulse generator. An acoustic isolator is positioned between the acoustic absorber and a support structure/heat sink. A preferred embodiment of the acoustic isolator includes at least a first material layer exhibiting a first acoustic impedance value, and a second material layer exhibiting a second acoustic impedance value. The second acoustic impedance value is substantially different from the first acoustic impedance value. A boundary between the first material layer and the second material layer causes multiple acoustic reflections of an acoustic pulse emanating from the rear face of the pulse generator. The first material layer and second material layer both exhibit substantial heat transfer capabilities. The acoustic isolator acts as a multiple reflective layer and prevents a substantial percentage of rear propagated acoustic energy from entering and being reflected by the support structure, thereby greatly reducing ultrasound display artifacts. A further embodiment of the acoustic isolator includes a single acoustic isolator layer and employs the support structure as a second layer.

Ultrasonic transducer

A miniature rotatable sensor include an acoustic face positioned over a layer of attenuating material. Between the acoustic face and the attentuating material is a flexible circuit that contacts the acoustic face and has circuit edge that extend beyond the attenuating material to create an inner portion. The inner portion further includes a radial slot extending throught the perimeter of the attenuating material. The circuit edges are folded into the radial slot such that the flexible circuit exits tangential to the diameter of the sensor.

Miniaturization of a rotatable sensor

A flexible circuit suitable for high density applications and having a long flexural life is disclosed. A thin film metallic ground plane deposited on a dielectric substrate electrically shields the conductor traces in the flexible circuit and eliminates cross-talk between conductor traces without reducing the flexibility or the flexural life of the flexible circuit.

Growing community of inventors

North Andover, MA, United States of America

Francis E Gurrie