Apple Inc.

Francesco Ferretti

Keith J Hendren

Ari P Miller

Mikael M Silvanto

Dinesh C Mathew

John Raff

Houtan R Farahani

Robert Y Cao

Kevin M Robinson

Simon R Lancaster-Larocque

Matthew Theobald

William A Counts

Robert J Lockwood

Simon J Trivett

Antonio Clarke

Genie Kim

Gurshan Deol

Prabhu Sathyamurthy

Victor H Yin

Jun Qi

Mingxia Gu

Edward J Cooper

Xinyu Zhu

Eric Lee Benson

Joshua A Spechler

Yanming Li

Meizi Jiao

Ian A Guy

Zhenyue Luo

Karan Bir

Youchul Jeong

Xiang Fang

Eric N Vergo

Chungjae Lee

Michael C Sulkis

Morteza Amoorezaei

Michael J Lee

Mengyang Liang

Sunitha Chandra

Marianna C Sbordone

Seth G McFarland

Jie Xiang

Mary M Morrison

Terence Chan

Collin D Chan

Joseph B Marcinkowski

Tom H Engbersen

Matthew S Theobald

A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a direct-lit backlight unit. The backlight unit may include an array of light-emitting diodes (LEDs) on a printed circuit board. The display may have a notch to accommodate an input-output component. Reflective layers may be included in the notch. The backlight may include a color conversion layer with a property that varies as a function of position. The light-emitting diodes may be covered by a slab of encapsulant with recesses in an upper surface.

Display modules with direct-lit backlight units

An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.

Multi-part device enclosure

Unitary structures having conductive portions electrically separated by non-conductive portions are described. In some embodiments, the non-conductive portions are made of metal oxide. In some embodiments, the method involves an oxidizing process adapted to convert an entire thickness at a selected portion of a metal substrate to a metal oxide, thereby creating metal portions that are electrically isolated from one another. In some embodiments, the thickness of the metal substrate is reduced at certain regions prior to oxidizing in order to provide a sufficiently thin metal for complete oxidization through the entire thickness. In some embodiments, the oxidizing process involves a plasma electrolytic oxidation process. In some embodiments, the plasma is concentrated at certain regions of the substrate for preferential oxidation. Applications for the substrate include enclosures and electrical components for electronic devices that use radio frequency communication.

Methods for electrically isolating areas of a metal body

Growing community of inventors

Morgan Hill, CA, United States of America

Francesco Ferretti