Abb Schweiz Ag

Abb Research Ltd.

Abb Technology Ag

Abb Inc.

Hitachi Energy Switzerland Ag

Abb Technology Oy

Hitachi Energy Ltd

Abb Power Grids Switzerland Ag

Francesco Agostini

Bruno Agostini

Daniele Torresin

Mathieu Habert

Thomas Gradinger

Didier Cottet

Berk Yesin

Pietro Cairoli

Colin Tschida

Antonello Antoniazzi

Luca Raciti

Tilo Buehler

Andreas Vögeli

Philipp Ganter

Munaf Rahimo

Zhiguo Pan

Federico Gamba

Alessio Bergamini

Hongrae Kim

Slavo Kicin

Patrik Reto Kaufmann

Timo Koivuluoma

Daniel Chartouni

Pierantonio Arrighetti

Sami Kotilainen

Lukasz Matysiak

Jakub Korbel

Gernot Riedel

Francoise Molitor

Daniel Kearney

Robert Sekula

Pierre Elser

Mahesh Dhotre

Christoph Haederli

Richard Thomas

Hamit Duran

Alessandro Adami

Benny Wedin

Matt D Cuppett

Mario Bortoli

Staffan Jacobsson

Brian Christopher

Andreas Hiller

Davide Leoni

Matteo Fabbri

Heikki Elomaa

Jari Sundelin

Chunlei Liu

Francesco Moraschinelli

Thomas Paul

Cooling arrangements are disclosed for solid state circuit breakers. In one arrangement, a MOV is disposed between two pulsating heat pipes. An IGCT is disposed on the other side of each pulsating heat pipe away from the MOV. In another arrangement, a bus bar is integral with a heat spreader disposed between a pulsating heat pipe and an IGCT.

Cooling of power semiconductors

A method for producing an electrical power device from subsequently manufactured parts by an additive manufacturing technique includes determining a target spatial distribution of a physical property of the electrical power device, the physical property being an electrical property and/or a mechanical property; forming a part of the electrical power device; selecting a physical property of a subsequent part of the electrical power device corresponding to the determined spatial distribution of the physical property such as to be different from a corresponding physical property of the part; and by means of the additive manufacturing technique, forming the subsequent part such that it is at least partially in contact with the part. An electrical power device is obtainable by the method, and the electrical power device may be used as an AC or DC insulator in an HVAC or HVDC apparatus.

Method for producing an electrical power device by additive manufacturing techniques

An arc chamber for a low voltage switching device including an insulating casing, having a first and a second lateral walls, a rear and a front wall, that defines an internal space housing a number or arc-breaking plates, a top wall of the casing having a discharge opening for venting off the gases from the internal space, the discharge opening being covered by a top cover. The arc chamber for a low voltage switching device includes a filter made of an open cell metal foam that is positioned at the discharge opening.

Arc chamber for a low-voltage switching device

A condenser includes a fluid inlet in an upper manifold and a fluid outlet in a lower manifold. The condenser includes multiport tubes provided with a plurality of separate flow channels which are delimited by outer opposite side walls and internal intermediate walls extending between the outer opposite side walls of the tubes. The multiport tubes define a channel space between them. A plurality of cooling plates extend between the upper manifold and the lower manifold. The cooling plates are in thermal contact with the multiport tubes to receive a heat load from fluid in the flow channels. The cooling plates have outer edges which protrude out from the channel space and are directed away from the channel space.

Condenser

Provided is a spring drive cam for a spring drive of a circuit breaker including a disc-like shape configured for rotating around a rotation axis in the spring drive, whereby the disc-like shape comprises a radius (R) that changes depending on an angle (&#x3b1;) of the radius (R) relative to a base angle (&#x3b1;), and whereby a rate (dR/d&#x3b1;) defined by a change of the radius (R) per change of the angle (&#x3b1;) is &#x2264;0.3 mm/&#xb0;.

Spring drive cam for a spring drive of a circuit breaker

An evaporator includes an inlet in a lower manifold, an outlet in an upper manifold, and a multiport tube extending between the lower manifold and the upper manifold. The multiport tube provides a flow path between the lower manifold and the upper manifold. One of the outer side walls of the multiport tube is provided with a first evaporator section with a first heat receiving surface and a second evaporator section with a second heat receiving surface, the first and second evaporator sections passing a heat load received via the respective first and second heat receiving surfaces to a fluid in said multiport tube. The first and second heat receiving surfaces form an angle with each other to align with and contact different surfaces of an object to be cooled.

Evaporator and manufacturing method

A surge arrester system includes a surge arrester, and an active cooling system having a cooling interface in contact with the surge arrester and operative to transfer heat from the surge arrester. The active cooling system includes a forced convection apparatus operative to provide forced convection cooling. A circuit breaker system includes a power semiconductor switch and an active cooling system constructed to cool the power semiconductor switch. The active cooling system includes a forced convection apparatus configured to provide forced convection cooling. The power semiconductor switch is in contact with the active cooling system. A surge arrester is disposed adjacent to and in contact with the active cooling system. The active cooling system includes a cooling interface constructed for contact with the surge arrester and operative to provide cooling to the surge arrester. The power semiconductor switch and the surge arrester dissipate power alternatively.

Surge arrester system and circuit breaker system

A heat exchange device may be based on a pulsating heat pipe and a cooling arrangement. The heat exchange device may include a plurality of pipes to provide fluid paths between a first fluid distribution element and a second fluid distribution element. Each pipe of the plurality of pipes may include a group of channels. Each of the first and second fluid distribution elements may include a plate of a first type. Each plate of the first type may include openings for providing alignment functionality for the plurality of pipes. The first fluid distribution element may include a plate of a second type that may include openings for providing fluid paths between the pipes. The plate of the second type may be positioned on a side of the plate of the first type of plates of the first fluid distribution element that is opposite to the second fluid distribution element.

Heat exchange device based on a pulsating heat pipe

A heat exchanger assembly is disclosed. The heat exchanger assembly comprises at least one passive cooling circuit, the passive cooling circuit including an evaporator connectable to a device to be cooled for conducting heat from the device to be cooled to the cooling fluid within the evaporator, thereby evaporating the cooling fluid, and a condenser interconnected with the evaporator for receiving the evaporated cooling fluid from the evaporator, releasing heat from the cooling fluid to an environment of the condenser, thereby condensing the cooling fluid, and for returning the condensed cooling fluid to the evaporator; and an active partial circuit comprising a compressor and an auxiliary condenser, the active partial circuit being activatable and deactivatable and being connected to the passive cooling circuit for receiving, in an activated state of the active partial circuit, the cooling fluid from the evaporator, for compressing the received cooling fluid by the compressor, for releasing heat, by the auxiliary condenser, from the compressed cooling fluid to an environment of the auxiliary condenser, and for returning the condensed cooling fluid to the evaporator. Furthermore, the passive cooling circuit is a base-to-air type thermosiphon or an air-to-air type thermosiphon.

Heat exchanger assembly and method for operating a heat exchanger assembly

This invention relates to a cooling apparatus comprising a base plate, an evaporator and a condenser. In order to obtain a simple and efficient cooling apparatus the evaporator is a porous aluminum evaporator having a capillary structure with pores and a plurality of larger sized evaporator channels extending through the evaporator between a second end and the first end of the evaporator. A compensation chamber extending along a second surface of the evaporator receives first fluid from the condenser such that pores opening up into the second surface of the evaporator are provided with first fluid.

Cooling apparatus and method

A power device comprises at least one power semiconductor module comprising a wide bandgap semiconductor element; and a cooling system for actively cooling the wide bandgap semiconductor element with a cooling medium, wherein the cooling system comprises a refrigeration device for lowering a temperature of the cooling medium below an ambient temperature of the power device; wherein the cooling system is adapted for lowering the temperature of the cooling medium in such a way that a temperature of the wide bandgap semiconductor element is below 100&#xb0; C.

Cooling of wide bandgap semiconductor devices

A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.

Cooling assembly and method for manufacturing the same

A cooling device for cooling at least two power electronic devices by a working fluid. The cooling device has a heat receiver portion of the Pulsating Heat Pipe circuit system and a pair of thermo-conducting walls provided on mutually opposite sides of the heat receiver arrangement and sandwiching the heat receiver portion between them. These walls are adapted for being thermally connected to a respective one of the power electronic devices. The cooling device further has a heat dissipator arrangement with a heat dissipator portion of the Pulsating Heat Pipe circuit system and a plurality of fins thermally coupled to the heat dissipator portion for transferring heat from the heat dissipator portion to an external cooling fluid for cooling the working fluid in the heat dissipator portion. The Pulsating Heat Pipe circuit system connects the heat receiver portion with the heat dissipator portion for transferring heat from the heat receiver portion to the heat dissipator portion by the Pulsating Heat Pipe action of the working fluid.

Cooling device and method for cooling at least two power electronic devices

The invention relates to a heat exchanger comprising a base plate for receiving a heat load from one or more electric components, an evaporator being in thermal contact with a surface of the base plate for transferring said heat load into a first fluid in the evaporator channels, and a condenser dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space receiving first fluid from the condenser, and the collector space which is located higher than the lower ends of the evaporator channels is in fluid communication with lower ends of the evaporator channels for passing first fluid received from the condenser to the lower ends of the evaporator channels.

Heat exchanger

The invention relates to a cooling element () comprising: a fluid channel () providing a pulsating heat pipe, a first evaporator () for receiving heat from electric components () and for passing the heat into fluid in the fluid channel (), and a first condenser () for receiving fluid from the first evaporator () via the fluid channel () and for cooling fluid in the fluid channel. In order to obtain an even temperature distribution at the first evaporator () an adiabatic zone where the temperature of the fluid in the fluid channel () remains unchanged or a cooling zone, with a second condenser () cooling fluid in the fluid channel (), separates the first evaporator () from the loops () in the second end () of the fluid channel.

Cooling element

Growing community of inventors

Zofingen, Switzerland

Francesco Agostini