Lucent Technologies Inc.

The University of North Carolina at Chapel Hill

Univ. of North Carolina

Fouad E Kiamilev

Ashok V Krishnamoorthy

James Albert Walker

David A Miller

Keith Wayne Goosen

Richard G Rozier

A method for designing an integrated circuit having optical inputs and outputs includes the step of selecting an integrated circuit design which includes at least one circuit cell design for processing electric signals. The circuit cell design has a predetermined number of electric inputs and electric outputs. The integrated circuit design also includes a plurality of layers of metalization for providing electric coupling. After the electronic integrated circuit design is selected, a predetermined number of optical input devices are located on the circuit cell design in a first prearranged orientation. The predetermined number of optical input devices is no greater than the predetermined number of electric inputs to the circuit cell. Also after the electronic circuit design is selected, a predetermined number of optical output devices are located on the circuit cell design in a second prearranged orientation. The predetermined number of optical output devices is no greater than the predetermined number of electric outputs to the circuit cell. At least a topmost layer of metalization is selected for electrically coupling each optical input device to a distinct one of the electric inputs of the circuit cell and for electrically coupling each optical output device to a distinct one of the electric outputs of the circuit cell. Finally, the completed design for the integrated circuit with optical inputs and outputs is recorded in a memory such as an electronic storage medium.

Electronic integrated circuit with optical inputs and outputs

A high-performance photonic chipset for computing 1-D complex fast Fourier transform (FFT) calculations. Flip-chip integration is used to combine submicron CMOS ICs with GaAs chips containing 2-D arrays of multiple-quantum wells (MQW) diode optical receivers and transmitters on each chip in the set. Centralized free-space optical interconnection offers higher throughput rates, greater external bandwidth and reduced chip count compared to conventional electronic FFT devices using hard-wired interconnection between chips. The memory addressing used provides one-to-one interconnections for memory transfers between computational stages that are compatible with several known three-dimensional free-space optoelectronic packaging technologies and dual-port memory is used to permit simultaneous read-write access to adjacent addresses in the data banks needed by each stage.

Photonic FFT processor

Method for designing an electronic integrated circuit with optical

Growing community of inventors

Charlotte, NC, United States of America

Fouad E Kiamilev