Advanced Photonics, Inc.

Foo Cheong Yit

Xueliang Song

Shurong Wang

Katsumasa Horiguchi

In manufacturing a submount, a first electrode layer () is formed as a layer on the surface of a submount substrate (); a side surface () of the first electrode layer () is formed on substantially the same plane as a side surface () of the submount substrate (); and the side surface () of the first electrode layer () is a connection surface for creating an electrical connection with the first electrode layer (). By making the first electrode layer () sufficiently thick, the surface area of the side surface () can be made sufficiently large to allow, for example, wire bonding using the side surface (). Further, components such as an optical element () can be protected by a sealing material ().

Growing community of inventors

Ota-ku, Japan

Foo Cheong Yit