Amazon Technologies, Inc.

Fnu Arun Kumar

Thomas A Volpe

Kun Xu

Kiran Kalkunte Seshadri

Thomas Elmer

Vasanta Kumar Palisetti

Sharukh Shahajahan Shaikh

An interconnect fabric in an integrated circuit (IC) device can be hierarchically partitioned into a set of peripheral sub-fabrics and a glue sub-fabric coupled to each of the peripheral sub-fabrics based on the physical design information associated with the IC device. Each of the peripheral sub-fabrics and the glue sub-fabric can be implemented using 2:1 hierarchical multiplexers based on an agglomerative clustering scheme. Physically aware design of the hierarchical multiplexer tree along with the optimal placement of the 2:1 multiplexers can provide smaller overall wire length and reduced routing congestion in the interconnect.

Physically aware design of interconnect fabric

Systems and methods are provided to enable parallelized multiply-accumulate operations in a systolic array. Each row of the systolic array can include multiple busses enabling independent transmission of inputs along the respective bus. Each processing element of a given row-oriented bus can receive an input from a prior element of the given row-oriented bus, and perform arithmetic operations on the input. Each processing element can generate an output partial sum based on the arithmetic operations, provide the input to a next processing element of the given row-oriented bus, without the input being processed by a processing element of the row located between the two processing elements that uses a different row-oriented bus. Use of row-oriented busses can enable parallelization to increase speed or enable increased latency at individual processing elements.

Multiple busses interleaved in a systolic array

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Mountain View, CA, United States of America

Fnu Arun Kumar