Harman International Industries, Inc.

Harman Becker Automotive Systems Gmbh

Robert Boschgmbh

Flórián Czinege

Yu Du

Péter Atilla Kardos

Darin Krajewski

Viktor Dobos

Zoltan Giang-Son Kleinheincz

Marco Salvatore Riemann

Lars-Dirk Anding

In at least one embodiment, a multi-stage sound and vibration sensor is provided. The multi-stage sound and vibration sensor includes a housing, a first piezo-diaphragm and a second piezo diaphragm. The first piezo-diaphragm and the second piezo-diaphragm are positioned in the housing to detect an input signal including audio or vibrations. The first piezo-diaphragm and the second piezo-diaphragm provide a first resonance frequency and a second resonance frequency in response to detecting the audio or the vibrations.

Multi-stage structure-borne sound and vibration sensor

The disclosure relates to a system, comprising a first circuit board comprising a control circuitry configured to control a beamforming array of microphones, and multiple second circuit boards attached to the first circuit board, each one of the multiple second circuit boards mounting a microphone of the array of microphones.

Matched beamforming microphone array

In at least one embodiment, a sound and vibration sensor is provided. The sound and vibration sensor includes a housing, a piezo-diaphragm, and a flexible support plate. The piezo-diaphragm is positioned in the housing to detect an input signal including audio or vibrations. The flexible support plate receives the piezo-diaphragm to enable the sensor to exhibit a frequency response with a plurality of resonant frequencies in response to detecting the audio or the vibrations on the input signal.

Structure-borne sound and vibration sensor

Growing community of inventors

Budapest, Hungary

Flórián Czinege