Ineos Styrolution Group Gmbh

Florian Wieberger

Norbert Niessner

Hans-Werner Schmidt

Gisbert Michels

Tobias Schulz

Tristan Kolb

Frank Eisentraeger

Janna Michaelis De Vasconcellos

Stephanie Baumann

Josef Meiners

Itana Lohse

Frank Eisenträger

Stéphanie Baumann

Itana Radovanovic

Thermoplastic moulding composition for 3D printing containing a polymer mixture A made of components a and b: a being from 30 to 95% by weight of at least one vinylaromatic copolymer a with average molar mass Mw from 150 000 to 360 000 g/mol, b being from 5 to 70% by weight of at least one impact modifier b, where the viscosity of the moulding composition (measured in accordance with ISO 11443) at shear rates of from 1 to 10 l/sec and at a temperature of 250&#xb0; C. is not higher than 1&#xd7;10Pa*s and the Melt Volume Rate (MVR, measured in accordance with ISO 1133 for 220&#xb0; C. and 10 kg load) is more than 6 ml/10 min.

Moulding compositions based on vinylaromatic copolymers for 3D printing

Thermally conductive polymer (TCP) resin compositions are described, comprising: 50 to 75% matrix polymer (I) comprising styrenic polymers (&#x393;) such as ABS (acrylonitrile-butadiene-styrene) resins, ASA (acrylonitrile-styrene-acrylate) resins and elastomeric block copolymers of the structure (S-(B/S))-S; and 25 to 50% thermally conductive filler material (II) (D0.1 to 200 &#x3bc;m), consisting of carbonyl iron powder (11-1) in mixture with multi wall carbon nanotubes, silicon carbide, diamond, graphite, aluminosilicates and/or boron nitride (II-2); wherein the volume ratio of (ll-1)/(ll-2) is 15:1 to 0.1:1. Shaped articles made thereof can be used for materials with antistatic finish, electrical and electronic housings, toys and helmet inlays.

Electrically conducting thermally conductive polymer resin composition based on styrenics with balanced properties

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Aalen, Germany

Florian Wieberger