Besi Switzerland Ag

Florian Speer

Hannes Kostner

Dietmar Lackner

Martin Widauer

Juergen Stuerner

Harald Handlos

The invention concerns the calibration of a component mounting apparatus configured to mount components on a substrate whose mounting places do not contain local markings. The substrate contains either global substrate markings attached to its edge or other global features that can be used to mount the components. Calibration is carried out by means of a calibration plate which has several calibration positions distributed two-dimensionally over the calibration plate and provided with first optical markings, a test chip which has second optical markings, and a holder attached to the bonding station for temporarily accommodating the calibration plate. The number and arrangement of the calibration positions of the calibration plate and the number and arrangement of the mounting places of the substrate are&#x2014;apart from possible exceptions&#x2014;different from one another.

Method for calibrating a component mounting apparatus

A kinematic holding system for a placement head of a placement apparatus comprises a placement head alignment device which comprises at least one length-variable holding member arranged at a distance from a joint between a placement head support and the placement head. This holding member determines the pivoting position of the placement head relative to the placement head support. The length of the holding member is changeable during the placement operation depending on a deformation of the placement head guide device caused by the pressing force of the placement head against the substrate in such a way that an axis error (tilt) of the placement head caused by the deformation of the placement head guide device is compensated.

Kinematic holding system for a placement head of a placement apparatus

The invention relates to a method for mounting semiconductor chips provided with bumps as flip chips on substrate locations of a substrate. The method comprises the placing of a flip chip in a cavity arranged in a stationary manner where the bumps are wetted with a fluxing agent and the position of the flip chip is determined by means of a camera. The method further comprises the use of a transport head and a bonding head, which allow rapid and highly precise mounting.

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Wörgl, Austria

Florian Speer