Siemens Aktiengesellschaft

Siemens Aktiengessschaft

Florian Schwarz

Hubert Schierling

Vladimir Danov

Stefan Stegmeier

Alexander Hensler

Stephan Neugebauer

Volker Müller

An electronic module includes a pulsating heat pipe having a channel structure for arrangement of a heat transport medium. The channel structure is formed of ceramic bodies, a metallic cover element, and a metallic carrier element. An electrical structural element is in contact with the heat transport medium.

Electronic module comprising a pulsating heat pipe

A semiconductor module assembly includes a cooling body having a cooling body main body and a cooling body attachment with a channel structure for a heat-transporting fluid. The channel structure is hermetically sealed with a cooling body main body surface so that the cooling body attachment and the cooling body main body are in direct contact with the heat-transporting fluid. The cooling body attachment includes a central piece having essentially parallel channels of the channel structure, and end pieces arranged on both sides of the central piece. Each end piece has deflection channels of the channel structure, which are arranged to establish a fluidic connection between the essentially parallel channels of the central piece. A semiconductor module contacts the cooling body, with the hermetically sealed channel structure of the cooling body attachment and the heat-transporting fluid forming a pulsating heat pipe which is thermally conductively connected to the semiconductor module.

Semiconductor module assembly having a cooling body and at least one semiconductor module

A heat transfer apparatus includes a heat chamber and a heat dissipating structure coupled to the heat chamber so as to jointly form a closed thermal circuit. The heat dissipating structure includes an outlet channel that leads off from the heat chamber and issues at an end that is remote from the heat chamber into a return duct which issues into the heat chamber. The return duct has a dimension which is smaller than a dimension of the outlet channel. The heat chamber is a boiling chamber or a steam chamber and the heat dissipating structure is a channel structure having steam regions and fluid regions. The heat chamber and the heat dissipating structure together form a pulsating or oscillating heating structure mechanism.

Heat transfer device and component

Growing community of inventors

Fürth, Germany

Florian Schwarz