Qualcomm Incorporated

Florian Rak

Sebastian Brunner

Kurt Wiesbauer

Gerhard Fuchs

Andreas Haas

Franz Tinauer

Horst Uwe Faulhaber

Stefan Leitinger

A package that includes an integrated device, a substrate coupled to the integrated device, and an encapsulation layer coupled to the substrate. The encapsulation layer encapsulates the integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, a buffer dielectric layer coupled to the at least one dielectric layer, and a buffer interconnect located at least in the buffer dielectric layer.

Package comprising a substrate that includes a stress buffer layer

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Deutschlandsberg, Austria

Florian Rak