European Aeronautic Defence and Space Company Eads France

Florian Moliere

Bruno Foucher

Alexandre Douin

Christian Binois

Daniel Peyre

Sebastien Morand

Gerard Salvaterra

Disclosed is in particular a device () for stressing an integrated circuit () including an electronic chip () mounted in a housing (), the device including a source () of thermal stress. The device () also includes a thermally conductive coupling member (), designed to be thermally coupled to the source () of thermal stress during the stressing operation. The coupling member () includes an end () whose geometry is suitable for being introduced into an aperture with a predefined geometry, to be made in the housing () of the integrated circuit () so as to thermally couple a coupling face () of this end () with a face () of the electronic chip ().

Methods and devices for stressing an integrated circuit

A method for estimating the lifetime of a deep-submicron-generation integrated electronic component, linked to a wear mechanism occurring in previously defined special conditions of use, said component being of a deep submicron type, with very large-scale integration, commercially available off the shelf, wherein one assumes that the same sample population always experiences a failure due to: the most predominant failure mechanism, during the period of useful life, described by an exponential law, and the most critical wear mechanism, represented by a Weibull distribution at the end of the previous period.

Method for estimating the lifespan of a deep-sub-micron integrated electronic circuit

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Paris, France

Florian Moliere