Ev Group E. Thallner Gmbh

Florian Kurz

Thomas Wagenleitner

Thomas Plach

Markus Wimplinger

Friedrich Paul Lindner

Jurgen Markus Suss

Viorel Dragoi

Jürgen Markus SÜSS

Paul Lindner

A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.

Device and method for bonding of two substrates

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Device and method for bonding substrates

A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force Fand holding the second substrate to a second sample holder surface of a second sample holder with a holding force F; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature T; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature Tis reduced at the second sample holder surface during the bonding.

Device and method for bonding of substrates

Growing community of inventors

Taufkirchen/Pram, Austria

Florian Kurz