Robert Boschgmbh

Florian Grabmaier

Frieder Haag

Ricardo Ehrenpfordt

Christian Ohl

Eckart Schellkes

Eric Ochs

Klaus Offterdinger

Kurt Weiblen

Ronny Ludwig

Markus Ulm

Rainer Straub

Johann Wehrmann

Frederik Ante

Michael Knauss

Patrick Wellner

Harald Emmerich

Holger Hoefer

Franz Schmich

Daniel Pantel

Stephan Henzler

Timo Lindemann

Balazs Jatekos

Christian Solf

Lutz Rauscher

Philipp Troebner

Thomas Klaus

Benno Roesener

Martin Holzmann

Tristan Jobert

Hansjoerg Beutel

Joerg Carls

Christian Gerhardt

Thorsten Wallisch

Christian Voehringer

Michael Struchholz

Dirk Dittmann

A device for precisely aligning a projection module relative to a projection surface. The device includes a bracket and a front. The bracket is designed to support the projection module. The front is designed to support the projection surface. The device further includes a compensating element for precisely aligning the projection module relative to the projection surface. The compensating element produces a firmly bonded connection between the bracket and the front or between the bracket and the projection module. A method for producing the device is also described.

Device for precisely aligning a projection module relative to a projection surface, method for producing the device

A light-emitting unit, comprising a substrate and a light-emitting device, which is situated on the substrate () and is designed to emit a laser beam. A swiveling light-deflecting device is situated on the substrate. A capping device is situated on the substrate and covers the light-emitting device and the light-deflecting device, the capping device having a first cap section and a transparent second cap section. The first cap section is designed to redirect the laser beam emitted by the light-emitting device onto the light-deflecting device. The light-deflecting device is designed to deflect the redirected laser beam in such a way that deflected laser beam is able to exit through second cap section.

Light-emitting unit and method for producing a light-emitting unit

A mechanical component having an adjustable part and a magnetic actuator device having at least one first permanent-magnetic element, which is able to be set into a first adjustment motion, whereby the adjustable part is able to be set into a first co-adjustment motion about a first axis of rotation, and wherein the magnetic actuator device includes at least one first external permanent magnet, which induces a first magnetic field and is able to be set into a first excitation motion such that the at least one first permanent-magnetic element is able to be set into the first adjustment motion. A production method for a mechanical component and a method for adjusting an adjustable part at least about a first axis of rotation in relation to its support, are also described.

Mechanical component and method for adjusting an adjustable part at least about one axis of rotation

A micromechanical device is described as having a stationary element () and a deflectable element. The invention relates to a light source that is situated on the deflectable element. Also described is a micromechanical scanner including a micromechanical device having a movable element with a light source disposed thereon.

Micromechanical device including a movable element having a laser disposed thereon

A method for producing a pressure sensor comprises providing a substrate with a depression; attaching a micromechanical sensor element to the substrate in the depression; attaching an evaluation circuit to the substrate next to the depression; electrically connecting the evaluation circuit to the sensor element; covering the substrate around the depression by means of a potting die such that the depression is closed; potting the evaluation circuit between the substrate and the potting die; and removing the potting die.

Micromechanical pressure sensor

A structural concept for a vertically hybridly integrated assembly having at least one MEMS component is provided, whose MEMS structure is developed at least partially in the front side of the component and which is electrically contactable via at least one connection pad on the front side of the component. This structural concept is able to be realized in an uncomplicated and cost-effective manner and allows the largely stress-free mounting of the MEMS structure within the chip stack and also ensures a reliable electrical linkage of the MEMS component to further component parts of the assembly. For this purpose, the structural concept provides for mounting the MEMS assembly headfirst on a further component of the chip stack via an interposer and for electrically linking it to the further component via at least one plated contacting in the interposer.

Vertically hybridly integrated assembly having an interposer for stress-decoupling of a MEMS structure, and method for its manufacture

An electrical device, particularly a control unit, having at least one joint having a first joining partner, especially a sleeve, and a second joining partner, especially a pin, the joint between the two joining partners having a junction; at least at the junction an at least partially solidified lubricant being present. Furthermore, in a method for lubricating a joint of an electrical device, the joint having a first joining partner, particularly a sleeve, and a second joining partner, particularly a pin; in a step one of the joining partners being wetted with a lubricant, in a following step the joining partner wetted with the lubricant being joined to the other joining partner and the lubricant subsequently solidifying.

Electrical device having a lubricated joint and a method for lubricating such a joint

A micromechanical projection device includes: a carrier which has a first, a second, and a third section, the second section being situated between the first and the third sections and having a flexible design; a mirror, which is mounted on the first section; and a light source which is mounted on the third section. The second section is bent in such a way that a light beam from the light source is directable onto the mirror.

Micromechanical projection device and method for manufacturing a micromechanical projection device

An integrated circuit includes an electronic circuit in a housing and a first contacting device for soldering the circuit to a corresponding second contacting device of a circuit board. The first and second contacting devices are each divided into a first section and a second section, the sections of one of the contacting devices being fixedly electrically connected to each other, and the sections of the other contacting device being selectively connectable to a device for resistance determination.

Solder joint inspection

A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.

Sensor device

A housing for a semiconductor component, in which the housing has a plurality of pins which are provided at the edge of the housing at distances, the pins each having a width, a thickness and a length. In order to create a housing for a semiconductor component whose characteristic frequencies are outside a range in which the characteristic frequencies of the housing negatively influence the semiconductor component, either at least one of the distances lies outside the range of 1.24 mm to 1.30 mm, at least one of the widths lies outside the range of 0.33 mm to 0.51 mm, at least one of the thicknesses lies outside the range of 0.23 to 0.32 mm, or at least one of the lengths lies outside the range of 2.05 to 4.12 mm.

Housing for a semiconductor component

A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure.

Chip housing having reduced induced vibration

A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.

Growing community of inventors

Tuebingen, Germany

Florian Grabmaier