Ledvance Gmbh

Osram Oled Gmbh

Florian Bösl

Andreas Dobner

Krister Bergenek

Tobias D Schmidt

Andreas Kloss

Frank Vollkommer

Reiner Windisch

Matthias Sperl

Matthias Sabathil

Meik Weckbecker

Stephan Finger

A device with a lead frame, a moulded body and a plurality of semiconductor chips configured to generate radiation is specified, wherein Furthermore, a method for producing devices is specified.

Device comprising leadframes, and method for producing a plurality of devices

An LED filament includes semiconductor chips arranged on a top side of a radiation-transmissive carrier, and at least partly covered with a radiation-transmissive first layer, the first layer and an underside of the carrier are covered with a second layer, phosphor is provided in the second layer, the phosphor is configured to shift a wavelength of the radiation of the semiconductor chip, no phosphor or phosphor including less than 50% of the concentration of the phosphor of the second layer is provided in the first layer, the carrier is formed from a further first layer and a carrier layer having cutouts, the carrier layer is arranged on the further first layer, the semiconductor chips are arranged on the further first layer in the regional of the cutouts of the carrier layer, and the first layer and the further first layer are at least partially covered with the second layer.

LED filament comprising conversion layer

A device with semiconductor chips on a primary carrier is disclosed. In an embodiment a device includes a primary carrier, a plurality of semiconductor chips arranged on the primary carrier, a radiation conversion material arranged at least in places on the semiconductor chips and the primary carrier, a secondary carrier to which the primary carrier is attached and a scattering body arranged on a front side of the secondary carrier facing the primary carrier, the scattering body covering the semiconductor chips, wherein the primary carrier is formed reflective to primary radiation at least in a region of the semiconductor chips, and wherein, during operation of the device, at least secondary radiation exits through a front side of the scattering body facing away from the secondary carrier and through a rear side of the secondary carrier facing away from the primary carrier.

Device with semiconductor chips on a primary carrier

The present invention relates to a lighting means comprising at least two LEDs, mounted on opposite sides of a flat printed circuit board, said printed circuit board being combined with a reflector which is free of LEDs, a part of the light emitted by each LED being reflected by the reflector to homogenize the light distribution generated by the lighting means, and specifically in each case with a directional component parallel to a surface direction of the flat printed circuit board.

Lighting means comprising LEDs

The present disclosure relates to a luminous means having a cap and an outer bulb in which LEDs are arranged on a flat multilayer substrate which is constructed, at least in regions, from at least two substrate layers between two outside surfaces which are opposite one another, wherein the at least two substrate layers are formed from a flat substrate sheet which is laid back on itself, and wherein the LEDs are mounted on a side surface of the substrate sheet, which at least proportionally forms the two outside surfaces of the multilayer substrate in each case on account of the substrate sheet being laid back, in such a manner that at least one of the LEDs is mounted in each case on both of the two outside surfaces of the multilayer substrate.

Luminous means having LEDs

A light fixture comprises two cooling elements and a plurality of semiconductor lighting elements, wherein each cooling element has a central portion and a wall portion which extends away from the central portion and at least partially surrounds an interior of a cooling element. The two cooling elements are arranged opposite one another. An annular opening for exchange of air with the environment is present between the two cooling elements. The semiconductor lighting elements are arranged on the outside of the wall portion of the cooling elements. A corresponding cooling element has two or more vanes, wherein all vanes are connected to one another by means of a central connecting element. Each vane extends in an axial direction and in a circumferential direction and has a curvature in the axial direction and preferably a curvature in the circumferential direction.

LED retrofit lamp and cooling element for a LED retrofit lamp

The present invention relates to a lighting means comprising at least two LEDs mounted on opposite sides of a flat printed circuit board, said printed circuit board being combined with a reflector which is free of LEDs, a part of the light emitted by each LED being reflected by the reflector to homogenize the light distribution generated by the lighting means, and specifically in each case with a directional component parallel to a surface direction of the flat printed circuit board.

A luminous means is disclosed, the luminous means having LEDs on a substrate, an outer bulb in which the substrate having the LEDs is arranged, and a cap, wherein at least two partial surfaces of the substrate are folded out with respect to the remaining substrate around a bridge area in each case, via which the particular partial surface is connected to the remaining substrate, and are thus set obliquely with respect to the remaining substrate which is flat per se, wherein, for each side surface of the remaining substrate, which side surfaces are opposite one another with respect to a thickness direction of the remaining substrate, at least one partial surface is folded out in each case, and wherein at least one of the LEDs is arranged on each of the partial surfaces.

Luminous means having LEDs arranged on fold-out surfaces

The present invention relates to a luminous means comprising an enveloping bulb, a base, a first LED and a second LED, which are assembled on a planar printed circuit board, to be precise on the opposite side thereof in relation to a thickness direction, wherein a first diverging lens is mounted on the first side of the printed circuit board in a manner assigned to the first LED and a second diverging lens is mounted on the second side of the printed circuit board in a manner assigned to the second LED for the purposes of homogenizing the light distribution generated by the luminous means, and the light emitted by the respective LED has a widened luminous intensity distribution downstream of the respective diverging lens in comparison with upstream of the respective diverging lens.

Growing community of inventors

Wuppertal, Germany

Florian Bösl