Advantest America, Inc.

Other

Adv Antest Corporation

Bionaut Labs Ltd.

Florent Cros

Lakshmikanth Namburi

Eran Oren

Ting Hu

Yohannes Desta

Michael Shpigelmacher

Alex Kiselyov

Lakshmi Namburi

Matt Losey

Laksmi Namburi

Suehyun Cho

Be'eri Berl Katznelson

Olin Palmer

Transferring electronic probe assemblies to space transformers. In accordance with a first method embodiment, a plurality of probes is formed in a sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) processes. The tips of the plurality of probes are formed adjacent to the sacrificial substrate and the remaining structure of the plurality of probes extends outward from the sacrificial substrate. The sacrificial material comprising the plurality of probes is attached to a space transformer. The space transformer includes a plurality of contacts on one surface for contacting the plurality of probes at a probe pitch and a corresponding second plurality of contacts on another surface at a second pitch, larger than the probe pitch, wherein each of the second plurality of contacts is electrically coupled to a corresponding one of the plurality of probes. The sacrificial substrate is removed, and the sacrificial material is removed, leaving the plurality of probes intact.

Transferring electronic probe assemblies to space transformers

An apparatus for electrically testing a semiconductor device comprises a probe card comprising a probe, wherein the probe comprises a probe tip. Further, the probe tip comprises a foot with an arbitrarily sized cross-section and an apex with an arbitrarily sized cross-section, wherein the cross-section of the foot is wider than the cross-section of the apex.

Methods to manufacture semiconductor probe tips

The method for forming a semiconductor probe tip comprises depositing a first copper layer onto exposed electrically conductive areas of a wafer. The first copper layer surrounds a non-conductive polymer structure on the wafer. The non-conductive polymer structure is removed to form a primary cavity in the first copper layer. The wafer and the primary cavity are coated with a polymer layer. Regions of the polymer layer are removed to form a secondary cavity within and alongside the primary cavity. A metal layer is deposited on exposed electrically conductive areas of the wafer and within bounds of the secondary cavity.

A method for testing a semiconductor device. The method comprises moving a probe in a vertical direction towards an electrical structure on a semiconductor device to position the probe alongside the electrical structure. A tip of the probe is positioned lower than an elevation of an outermost periphery of the electrical structure. The method also includes moving the probe in a lateral direction towards the electrical structure to contact the electrical structure. The probe tip mechanically and electrically engages the electrical structure.

Laterally driven probes for semiconductor testing

An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; wherein each probe is capable of elastic deformation when the probe tip comes in contact with the electronic devices; each probe comprising a plurality of isolated electrical vertical interconnect accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.

Fine pitch probes for semiconductor testing, and a method to fabricate and assemble same

An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; each probe capable of elastic deformation when the probe tip comes in contact with the electronic; each probe comprising a plurality of isolated electrical vertical interconnected accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.

Provided are microfabricated probe elements, including elastomer elements, and methods of making the same, that can be readily used with fine pitch microelectronic arrays, for instance by providing sufficient compliance in a small package, while minimizing deflection forces, and while precisely maintaining the planarity and positioning of the contact tips across vast grid arrays. Elastomer elements may be generated using photolithography, either directly or through a sacrificial lost-mold process. Elastomer probe elements are provided with rigid tip structures microfabricated thereon to improve contact pressure. A novel space transformation probe card assembly is also provided.

Growing community of inventors

Los Angeles, CA, United States of America

Florent Cros