Intel Corporation

Florence Su Sin Phun

Kai Chong Ng

Boon Ping Koh

Ying Ern Ho

Natasya Athirah Abdul Khalid

Nik Mohamed Azeim Nik Zurin

Asmah Truky

Wei Jern Tan

Yee Hung See Tau

An embodiment includes an apparatus comprising: a rod-shaped substrate including a rod long axis; a first layer, including a first interconnect, substantially surrounding the substrate in a first plane that is orthogonal to the rod long axis; and a second layer, including a second interconnect, substantially surrounding the first layer in the first plane. Other embodiments are described herein.

Rod-based substrate with ringed interconnect layers

A printed circuit board (PCB) includes a dielectric plane and a ground plane parallel to and spaced apart from the dielectric plane. The dielectric plane includes a pair of signal traces and a 3-dimensional (3D) grounded (GND) fence located between the pair of signal traces. The 3D GND fence is electrically connected to the ground plane, and protrudes perpendicularly from the dielectric plane. The 3D GND fence is located equidistant from each of the pair of signal traces, and the 3D GND fence is configured to block electromagnetic interference (EMI) from a first of the pair of signal traces to a second of the pair of the signal traces. The pair of signal traces is configured to form part of a noise-sensitive electronic circuit. The 3D GND fence may have a rectangular configuration.

Noise sensitive trace 3D ground-shielding crosstalk mitigation

Growing community of inventors

Gelugor, Malaysia

Florence Su Sin Phun