Technoprobe S.p.a.

Flavio Maggioni

Roberto Crippa

Raffaele Vallauri

Riccardo Liberini

Andrea Calaon

Giovanni Campardo

Ricardo Liberini

A method for manufacturing a probe head for the functionality testing of devices under test (DUT) is disclosed. The method includes providing a containment element, arranging a lower guide at a lower face of the containment element which faces toward the devices under test during the test, and arranging an upper guide at an upper face of the containment element. The containment element is interposed between the lower and upper guides which are initially in the shape of a single plate connected to the containment element. The method further includes cutting the lower and/or upper guide thereby defining a plurality of guide portions that are independent and separated from each other, and inserting a plurality of contact elements into respective guide holes formed in the guides. The contact elements are adapted to contact pads of the devices under test. A probe head obtained by the method is also disclosed.

Large probe head for testing electronic devices and related manufacturing method

A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

Testing head having improved frequency properties

A flexible membrane adapted to carry high-frequency power signals is described having a plurality of contact pads in a central portion of the flexible membrane connected to a plurality of micro contact probes and a plurality of contact structures connected to a support plate in a peripheral portion of the flexible membrane, as well as a plurality of conductive tracks connecting the contact pads with the contact structures. The flexible membrane further includes an intermediate portion between the central and peripheral portions. The elastic membrane is divided into a first area having a first total thickness and into a second area having a second total thickness. The first area is contiguous and adjacent to the second area. The first total thickness is less than or equal to 75 μm and the second total thickness is greater than the first total thickness.

Flexible membrane adapted to carry high-frequency (RF) power signals and corresponding probe card for the high-frequency (RF) power test of electronic devices

A method of manufacturing a multi-layer for a probe card comprises providing first contact pads on an exposed face of a first dielectric layer and second contact pads on an exposed face of a last dielectric layer. Each dielectric layer is laser ablated to realize pass-through structures and the pass-through structures are conductively filled to realize conductive structures. The dielectric layers are superimposed in a way that each conductive structure contacts a corresponding conductive structure of a contiguous dielectric layer in the multi-layer and forms conductive paths electrically connected the first and second contact pads. The second contact pads having a greater distance between its symmetry centers than the first contact pads, the multi-layer thus performing a spatial transformation between the first and second contact pads connected through the connective paths.

Manufacturing method of a multi-layer for a probe card

A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.

Probe head for a testing apparatus of electronic devices with enhanced filtering properties

A testing head comprises a plurality of contact probes, and a guide having a plurality of guide holes for housing the contact probes and including a conductive portion. Each contact probe includes a first end region and a second end region, and a body which extends between the first and second end regions. Suitably, the conductive portion includes a group of the guide holes and electrically connects contact probes of a first group of the contact probes. The contact probes of the first group slide in the guide holes in the conductive portion and are adapted to carry a same signal, and each contact probe of a second group of the plurality of contact probes is surrounded by an insulating coating layer that extends along the body of each contact probe of the second group, thereby insulating the contact probes of the second group from the conductive portion.

Testing head with improved frequency property

A contact probe for a testing head of an apparatus for testing electronic devices comprises a body extending along a longitudinal axis between a first end portion and a second end portion, the second end portion being adapted to contact pads of a device under test. Suitably, the contact probe comprises a first section, which extends along the longitudinal axis from the first end portion and is made of an electrically non-conductive material, and a second section, which extends along the longitudinal axis from the second end portion up to the first section, the second section being electrically conductive and extending over a distance less than 1000 &#x3bc;m.

Contact probe for a testing head for testing high-frequency devices

A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer comprises a plurality of contact elements, each comprising a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements, the guide comprising a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

A probe card for a testing apparatus of electronic devices comprises at least one testing head housing a plurality of contact probes, each contact probe having at least one contact tip abutting onto contact pads of a device under test, as well as at least one space transformer realizing a spatial transformation of the distances between contact pads made on its opposite sides and connected by means of suitable conductive tracks or planes, as well as a plurality of filtering capacitors provided between the space transformer and a PCB, which comprises direct conductive tracks or planes contacting conductive portions of the filtering capacitors.

Probe card for a testing apparatus of electronic devices with enhanced filtering properties

An interface board of a testing head for a test equipment of electronic devices is described. The testing head includes a plurality of contact probes, each contact probe having at least one contact tip suitable to abut against contact pads of a device to be tested, as well as a contact element for the connection with a board of the test equipment. Suitably, the interface board comprises a substrate and at least one redirecting die housed on a first surface of that substrate and a plurality of contact pins projecting from a second surface of that substrate opposed to the first surface. The redirecting die includes at least one semiconductor substrate whereon at least a first plurality of contact pads is realized, suitable to contact a contact element of a contact probe of the testing head, the contact pins being suitable to contact the board.

Growing community of inventors

Cernusco Lombardone, Italy

Flavio Maggioni