Esilicon Corporation

Marvell Asia Pte., Ltd.

Ferran Martorell

Prasad Subramaniam

Hao Nham

Rakesh Chadha

Luciano Lavagno

Jordi Cortadella

Carlos Macian

An integrated circuit includes a first set of dies, each die comprising circuitry and a second set of interposer dies. At least two dies of the first set of dies are connected to each other via at least one of the interposer dies. The at least one of the interposer dies includes first connections connected to a first die of the first set of dies, second connections connected to a second die of the first set of dies, and buffers connected between the first connections and the second connections. The buffers are configured to condition signals between the first die and the second die.

High density low power interconnect using 3D die stacking

An electronic circuit is implementing using a first logic die, a second logic die, and an interposer array connecting the first logic die to the second logic die. The first logic die includes an array of output contacts. The second logic die includes an array of input contacts. The interposer array includes a plurality of interposer dice. Each interposer die includes a plurality of input contacts and a plurality of output contacts. The array of output contacts of the first logic die is bonded to at least a subset of input contacts from the plurality of input contacts of an interposer die of the plurality of interposer dice. The array of input contacts of the second logic die is bonded to at least a subset of output contacts from the plurality of output contacts of the interposer die of the plurality of interposer dice.

In one aspect, a method for providing design point recommendations for an integrated circuit (IC) design is disclosed. The method comprises receiving an IC design along with a reference PPA (power, performance, area) metric at a reference design point, and a target PPA metric. The method also comprises estimating trial PPA metrics for the IC design at multiple design points, wherein estimating trial PPA metric at each design point includes accessing a PPA database containing PPA metrics for multiple test components, determining scale factors from the reference design point to the trial design point for test components equivalent to components of the IC design, and applying the scale factors to the reference PPA metric to determine the trial PPA metric for the trial design point. The method further comprises recommending a trial design point based on the estimated trial PPA metric and the received target PPA metric.

Integrated circuit design scaling for recommending design point

Scaling logic components of integrated circuit design

Scaling of integrated circuit design including high-level logic components

Scaling of integrated circuit design including logic and memory components

Integrated circuit design optimization

Scaling memory components of integrated circuit design

Apparatus and methods for clock domain crossing between a first clock domain and a second clock domain. The apparatus comprises a first control logic element for processing a handshake signal and producing a first arbiter input signal. Concurrently a second control logic element processes a second handshake signal and produces a second arbiter input signal. Exemplary embodiments include exactly one arbiter element inputting the first arbiter input signal, inputting the second arbiter input signal, outputting a first clocking signal to the first sequential element and outputting a second clocking signal to the second sequential element. For managing metastability by controlling the timing of the clocking inputs of the sequential devices, the apparatus includes a first controllable lock delay element selected to satisfy the setup constraint of the second sequential element, and a second controllable lock delay element selected to satisfy the hold constraint of the second sequential element.

Asynchronous scheme for clock domain crossing

Growing community of inventors

Barcelona, Spain

Ferran Martorell