Novellus Systems Incorporated

Space Foundry Inc.

Fergal John O'Moore

Steve Schultz

Brian Severson

Lief Niklas Dennis Nordlund

Ramprasad Gandhiraman

Arlene Lynette Lopez

Described herein are apparatus and methods of printing in the presence of plasma. The apparatus includes a modular print head comprising an inlet module, a plasma module with movable electrode configurations, and a nozzle module. The modular design of the print head allows for printing on and treatment of surfaces in many different applications.

Modular print head assembly for plasma jet printing

Chemical-mechanical polishing or planarization (CMP) is enhanced with multi-zone slurry delivery. A polishing pad is provided that contacts with the work piece, and a multi-zone platen is displaced proximate to the polishing pad to facilitate slurry delivery. The platen includes multiple fluid distribution layers that each include a fluid-distributing channel extending from a fluid source to a distribution point on layer. The distribution points on each of the fluid distribution layers correspond to different locations on the polishing surface to thereby create multiple fluid-delivery zones on the pad.

Chemical mechanical polishing with multi-zone slurry delivery

Chemical mechanical planarization apparatuses with polishing assemblies that provide for the passive removal of slurry are provided. In accordance with an embodiment, a work piece polishing assembly comprises a polishing pad comprising a polishing surface and an exhaust aperture that extends through the polishing pad from the polishing surface and is configured to receive a slurry from the polishing surface. An underlying member is disposed underlying the polishing pad and comprises a peripheral surface. The underlying member comprises a channel that is in fluid communication with the aperture and that opens at the peripheral surface of the underlying member.

CMP apparatuses with polishing assemblies that provide for the passive removal of slurry

A chemical-mechanical polishing apparatus is provided that creates a uniform kinematical pattern on the surface of a wafer being polished. The apparatus may have a polishing pad comprising a polishing pad surface having a center point that lies within an axis of motion for the polishing pad and a plurality of grooves entrenched in the polishing pad surface and defining a pattern of shapes. The pattern has an axis of symmetry that is offset from the polishing pad surface center point. The apparatus may be operated in a manner such that the kinematics of the CMP process are uniform across the surface of the wafer.

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Los Gatos, CA, United States of America

Fergal John O'Moore