Memc Electronic Materials, Inc.

Ferdinando Severico

Carlo Zavattari

Paolo De Maria

A wire saw () for simultaneously slicing multiple, generally cylindrical monocrystalline ingots () into wafers. The wire saw includes a cutting head (), an ingot support (), and multiple generally parallel lengths of cutting wire () defining a cutting web (). A slurry delivery system includes nozzles (, and) positioned for dispensing slurry along the wire web generally at lateral sides of each ingot. A process for simultaneously slicing at least two generally cylindrical semiconductor ingots into wafers includes mounting at least two ingots to a common ingot support, moving the ingot support relative to the cutting web so that the two ingots simultaneously press against the cutting web at cutting regions, and dispensing a liquid slurry to at least three locations on the wire web including two outermost sides of the cutting regions and a location between each pair of ingots.

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Novara, Italy

Ferdinando Severico