Siemens Aktiengesellschaft

Ferdinand Utner

Harald Vetter

Reinhard Behn

Gerhart Vilsmeier

Udo Hieber

Friedrich J Gaenge

Herbert Bolz

Ludwig Berg

Ludwig Nutz

A capacitor winding is integrated in a metallic housing that is closed in a moisture-tight and gas-tight manner by a cover. Spaced bushings are connected to and extend through the cover. The cover has the shape of a spherical cap with an outwardly directed arch.

Electrical capacitor

A chip component incorporating an electrical or electronic function member (2) and having terminal elements (7, 8) is integrated in a pre-fabricated housing (9) of cup shape composed of insulating material, with the function member (2) being held in the housing (9) by supporting elements (12) so as to form at least one air gap (10) that is 1 mm less wide and that separates the function member (2) from the inner housing surfaces (11) on all sides except where the function member (2) is fixed in the housing (9) with small-area supporting elements (12).

Chip component for fastening to a circuit board, comprising an

A wound electrical capacitor, particularly a power capacitor, that is integrated in a housing together with an over-pressure breakaway fuse that is composed of an electrical current conductor having a rated break point arranged at least partially in a hollow tube, and whereby the current conductor is releasably secured to an inwardly-arced floor upon interposition of an insulator.

Wound electrical capacitor

An electrical capacitor (1) which has at least substantially rectangular cross-section and is mounted in a plastic cup (2) and is potted with casting resin. Pairs of impressions (12, 13) are formed into the edges of the plastic cup (2), and the capacitor (1) is simultaneously centered and fixed. It is thereby assured that the capacitor retains its prescribed position during potting and, moreover, a uniformly thick resin layer is present between the capacitor (1) and the plastic cup (2).

Capacitor mounted in a plastic cup and method for manufacturing such

An electrical capacitor and manufacturing method therefor includes protective cover layers each of which has an insulating strip on each of two projections. During manufacture, an apparatus which forms intermittent metal-free strips during the winding of the capacitor is switched to continuous operation for the windings of the cover layers so that continuous metal-free strips are formed.

An electrical capacitor and manufacturing method therefore includes protective cover layers each of which has an insulating strip on each of two projections. During manufacture, an apparatus which forms intermittent metal-free strips during the winding of the capacitor is switched to continuous operation for the windings of the cover layers so that continuous metal-free strips are formed.

Method for manufacturing electrical capacitors

An electrical layer capacitor is formed of a stack of individual capacitors, each of which is formed of a plastic carrier layer, of a metal coating as an electrode applied thereto, of a plastic film as a dielectric generated thereon by glow polymerization, and a further metal coating applied as a cooperating electrode. The metal coatings of a same polarization are conducted to same lateral faces of the stack, and the individual capacitors are limited along a longitudinal direction of the stack by a straight cut at one side and by a wavy cut at the other side.

Electrical layer capacitor and method for the manufacture thereof

An electrical capacitor formed of metallized dielectric layers connected alternatingly to two power lead projections by the presence or absence of metal-free insulating strips includes a wavy cut edge and a smooth cut edge on alternate dielectric layers to which metal coatings are applied for improved adhesion and electical contact.

Electrical capacitor and method for the manufacture thereof

An electric capacitor which can be soldered to a printed circuit board in the manner of a chip component, without damaging the capacitor, has capacitor plates with electrodes therebetween arranged in a stack, the electrodes alternatingly terminating at opposite end faces of the capacitor, at which a metal plating is applied, with a portion of respective bands of flexible metal being disposed adjacent each metal plating forming current leads, with the portion of the band adjacent the metal plating being encapsulated with the capacitor, and a remaining portion of each band projecting outside of the encapsulation and being bent at least partially around exterior sides of the encapsulation and forming soldering surfaces. A method for manufacturing such a capacitor includes the steps of cutting spaced recesses in a metal plate for producing a number of continuous parallel bands extending between two margins of the plate, cutting and bending those bands and inserting a stacked capacitor with the metal platings between the cut ends of the band, encapsulating the capacitor and the portions of the bands adjacent thereto, and severing the opposite ends of the bands from the plate margins and bending the severed portions around a part of the exterior of the encapsulation.

Electric capacitor in the form of a chip component and method for

An electrical network containing at least one electric resistor, includes a support foil and at least one resistance layer coating the support foil forming the at least one electric resistor. The support foil and resistance layer are folded along a zig-zag line forming two outer surfaces of the resistance layer. Contact layers are each disposed on a different one of the outer surfaces of the resistance layer, a plastic layer is applied on the contact layers, and outer contact layers each make contact with a different one of the contact layers. A method is also provided for producing the same.

Electrical network and method for producing the same

A mechanically stable electrical network has a metal carrier and an insulating layer which supports the electrical network on the metal carrier.

Electrical network

A bridge circuit consisting of two or more resistance strain gauges is formed on a synthetic layer on which a resistance layer and a metal layer provided for the terminal elements are applied. The corresponding patterns are etched into the metal and into the resistance layer. Balance surfaces consisting of materials with a temperature coefficient different from that of the resistance layer are connected in series to the resistance strain gauges. By changing the resistance of the balance surfaces, the circuit is balanced in terms of symmetry, in terms of the temperature coefficient of the resistance layer, and in terms of the temperature coefficient of the modulus of elasticity of the test object.

Bridge circuit formed of two or more resistance strain gauges

A resistance strain gauge in which a resistance layer is applied to a carrier and provided with terminal elements is particularly characterized in that a patterned, thin, non-self-bearing resistance layer is materially bonded to a synthetic layer, and that the resistance layer is overlapped by a patterned, solderable contact layer and is materially bonded to the contact layer.

Resistance strain gauge

A process for encapsulating electrical components with a continuous layer of synthetic resin material contemplates induction heating of the component by high frequency current with the component leads covered by heat insulating material, and subjecting the heated component to a vortex bath of synthetic resin powder so as to fuse or sinter the powder to the component. Because the leads have not been heated, no resin is sintered thereto, so that scraping or other removal of resin from the leads to make electrical contact therewith need not be undertaken as an additional step. During hardening of the resin the heat insulation may be left in place on the leads to allow the hardened resin to form 'feet' on a base of the component, or the heat insulation may be displaced slightly to allow flow of the hardening resin around the lead without forming a fillet.

Process for encapsulating electrical components by vortex sintering

A process for simultaneously batch-coating a number of electric components having radial connections wires extending in approximately parallel relation from the element to be covered utilizes a plate having a hole pattern therein for receiving the wires to retain the elements during coating. A synthetic foil is first placed over the plate and the wires are forced through the foil into the holes. A grid having openings therein formed by perpendicular walls for surrounding the elements is placed over the plate for use as a casting mold. A casting resin is deposited over the grid in excess quantity, and is then smoothed by moving a doctor over the grid. After the resin has hardened, the grid is removed and the individual elements, with the resin adhering to the synthetic foil, are separated.

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Wuppertal, Germany

Ferdinand Utner