At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Tridonic Jennersdorf Gmbh

Ferdinand Lutschounig

Markus Leitgeb

Jonathan Silvano De Sousa

Marco Gavagnin

Christian Vockenberger

Gernot Grober

Heinz Moitzi

Erich Schlaffer

Mike Morianz

Thomas Krivec

Bernhard Reitmaier

Sabine Liebfahrt

Gregor Langer

Gernot Schulz

Hans Hoschopf

Rainer Frauwallner

Markus Frewein

Julia Platzer

Mario Damej

Franz-Peter Wenzl

Gernot Gmundner

Raymond Yi

Naoto Yokoi

Florian Matt

Hubert Haidinger

Eva Maria Volkheimer

A method of manufacturing a component carrier includes (i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) assembling a component to the stack; and (iii) forming a thermally conductive tongue having an embedded portion embedded in the stack and having an exposed portion protruding beyond the stack, where a first width of the tongue in the embedded portion is different from a second width of the tongue in the exposed portion. A corresponding component carrier includes analogous features.

Component carrier with protruding thermally conductive tongue and corresponding method of manufacturing

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack and has a non-polygonal outline. A component is in the cavity. A method of manufacturing such a component carrier is also provided.

Component carrier and method of manufacturing the same

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.

A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure.

Component carrier having a three dimensionally printed wiring structure

Method for the manufacture of a printed circuit board with at least one cavity for the accommodation of an electronic component, wherein the cavity walls exhibit a reflective, in particular mirrored reflector layer characterized by the following steps: Provision of a printed circuit board, Application of a temporary protective layer onto at least a section of the surface of the circuit board, Creation of the cavity by way of penetration of the protective layer in the region of the cavity, Application of the reflector layer, Removal of the temporary protective layer.

Method for producing a circuit board

Growing community of inventors

Ferlach, Austria

Ferdinand Lutschounig