Xilinx, Inc.

Ferdinand F Fernandez

Gamal Refai-Ahmed

Suresh Ramalingam

Ivor G Barber

Tien-Yu Lee

Jaspreet Singh Gandhi

Inderjit Singh

Henley Liu

Myongseob Kim

Nael Zohni

Methods and apparatus are described for heat management in an integrated circuit (IC) package using a lid with recessed areas in the inner surfaces of the lid. The recessed areas (e.g., trenches) provide receptacles for accepting a portion of a thermal interface material (TIM) that may be forced out when the lid is positioned on the TIM above one or more integrated circuit (IC) dies during fabrication of the IC package. In this manner, the TIM bond line thickness (BLT) between the lid and the IC die(s) may be reduced for decreased thermal resistance, but sufficient interfacial adhesion is provided for the IC package with such a lid to avoid TIM delamination.

Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management

A method and apparatus are provided which improve heat transfer between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes a first IC die, a package substrate, a lid and a stiffener. The first IC die is coupled to the package substrate. The stiffener is coupled to the package substrate and circumscribes the first IC die. The lid has a first surface and a second surface. The second surface faces away from the first surface and towards the first IC die. The second surface of the lid is conductively coupled to the IC die, while the lid is mechanically decoupled from the stiffener.

Stacked silicon package assembly having an enhanced lid

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San Jose, CA, United States of America

Ferdinand F Fernandez