Vayo (Shanghai) Technology Co., Ltd.

Other

Fengshou Liu

Shengjie Qian

Jishuo Liu

Yongjian Qu

Zhongliang Zhu

Pan Su

Jiuxuan Liu

Jihong Wu

A system-in-package technology-based process design method and system, a computer readable storage medium, and a device. The system-in-package technology-based process design method includes: acquiring design data of a layout and three-dimensional model data associated with the layout; associating and matching the design data with the three-dimensional model data according to the designed components' attribute information in the design data, and assembling the design data and the three-dimensional model data into an integrated package model; and performing assembly process analysis on the integrated package model to identify unreasonable design points used for design modifications and references, or directly exporting, from the integrated package model, a packaging process manufacturing program for fabrication.

System-in-package technology-based process design method and system, medium, and device

An EDA pad package library updating/application method and system, a medium, and a terminal. The method includes: extracting a graphic data of a pad and setting information of a component based on the pad from an EDA wiring data; querying and downloading a graphic model of the component according to attribute information of the component; forming a simulated package pad by simulating and assembling the graphical model of the component and the graphical data of the pad according to setting information of the component based on the pad; storing the simulated package pad in a model database, updating an existed EDA pad package library by associating the simulated package pad to a predetermined keyword/words in the model database. A package pad created by others can be quickly obtained without a package pad library. The best pads that have been verified can be updated continuously and quickly.

EDA pad package library updating/application method and system, medium and terminal

A method for detecting an open/short circuit on a PCB design layout includes: reading PCB data of a to-be-checked PCB design layout, to output an image of each PCB layer included in the PCB design layout; performing a first connectivity analysis on the image of each PCB layer to classify pad patterns connected with each other in the same layer into a corresponding child network group; performing a second connectivity analysis to classify child network groups in which pad patterns connected by the same electroplated hole, into a corresponding parent network group; reading IPC netlist data of the PCB design layout, to obtain a netlist network group in which each pad pattern is; and determining whether a netlist network relationship of the pad patterns is consistent with a network relationship obtained after the second connectivity analysis in order to determine whether there is an open/short circuit.

Method, system, and electronic device for detecting open/short circuit of PCB design layout

The present disclosure provides a method, system and apparatus for detecting polarity of component, and a computer-readable storage medium. The component polarity detection method includes: selecting first component symbols similar to graphs in a pre-created template library of component polarity symbols from a polar graph layer of a to-be-detected printed circuit board (PCB), and sifting out second component symbols each having polarity from the selected first component symbols; and traversing each second component symbol having polarity, to detect whether a polarity symbol that has been already stored in the template library is in the second component symbol having polarity; if yes, examining whether a polarity position of the polarity symbol in the second component symbol is correct; and if the polarity position is incorrect, outputting a report indicating that the polarity position of the polarity symbol in the second component symbol is incorrect.

Method, system and apparatus for detecting polarity of component, and computer-readable storage medium

A PCB stencil manufacturing method and system. The method comprises: inputting PCB stencil design information in a preset input format, the PCB stencil design information comprises solder pad element information; and converting the PCB stencil design information into corresponding system core data information, the system core data information comprises solder pad element packaging information, and the solder pad element packaging information comprises a solder pad element packaging pattern and solder pad element coordinates; and querying a stencil opening database according to the solder pad element packaging pattern, records in the stencil opening database comprise the following attributes: a solder pad element packaging pattern and a stencil opening pattern; and placing a stencil opening pattern corresponding to a matching solder pad element packaging pattern to an opening layer according to the solder pad element coordinates.

PCB stencil manufacturing method and system

The present disclosure provides a PCBA detection method and a system based on 3D AOI and AXI. The method includes: preconfiguring graphical data in a part physical database; obtaining CAD data related to a PCB based on design data input from PCB design software; converting the generated CAD data, and generating 3D basic graphical data to generate a 3D physical model; extracting BOM information from the design data, searching the part physical database for matched graphical data based on the BOM information, if the matched graphical data is found, generating a 3D physical model based on the graphical data; if the matched graphical data is not found, generating corresponding image data based on obtained created data, to generate a 3D physical model; and generating standard 3D detection prototype data, outputting the standard 3D detection prototype data to 3D AOI and AXI for detection.

PCBA inspection method and system based on 3D AOI and AXI

The present invention provides a quick processing system and method for SMT equipment, that is: firstly read PCB design files and BOM files inputted, and generate core data including text data and graphic data of all components to be assembled; then search the component data matched with each component to be assembled in the local database on basis of the core data, and link the found component information with the corresponding component to be assembled, and mark the component information as an available component, and create component information on basis of the core data of the component to be assembled, and stored to the local database, then mark the component information as an available component, and recover the component information on basis of the graphic data in the core data as an error is checked out; finally output the validated component information to the SMT equipment system.

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Shanghai, China

Fengshou Liu