Toyota Motor Engineering & Manufacturing North America, Inc.

Toyota Jidosha Kabushiki Kaisha

Leland Stanford Junior University

University of Colorado

North America, Inc.

Feng Zhou

Ercan Mehmet Dede

Shailesh N Joshi

Hiroshi Ukegawa

Danny J Lohan

Ercan Mehment Dede

Yanghe Liu

Shohei Nagai

Tianzhu Fan

Yuqing Zhou

Hitoshi Fujioka

Ki Wook Jung

Kenneth E Goodson

Yuji Fukuoka

Mehdi Asheghi

Dragan Maksimovic

Robert Warren Erickson

Vivek Sankaranarayanan

Yucheng Gao

Tomoki Tambo

Hiroshi N Ukegawa

Jae Seung Lee

Paul Timothy Fanson

Gaohua Zhu

Tsuyoshi Nomura

Douglas G Thorpe

Kyosuke N Miyagi

James W Palko

Srivathsan Sudhakar

The present disclosure is directed to systems and methods for cooling an electric aircraft. The system comprises an electronic device, a casing, a fin, and at least one PHP. The casing comprises an inner surface. A PHP may be coupled to the inner surface. The fin comprises a fin interior cavity. A PHP may be embedded within the fin interior cavity. The same PHP may be both coupled to the casing inner surface and embedded within the fin interior cavity, or there may be a plurality of fins such that at least one fin is coupled to the casing inner surface and at least one fin is embedded within the fin interior cavity. The portion of the PHP closest to the electronic device comprises an evaporator section and the portion of the PHP furthest from the electronic device comprises a condenser section.

Systems and methods for cooling an electric aircraft

One or more methods of designing an FC bipolar plate that enhance the operational performance of FC. A first image analysis is conducted of image data of a fluid flow field structure having one or more dehomogenized microstructures to identify channels having a fluid flow blockage at a channel wall dead-end. The channel wall dead-end of each identified channel is selectively removed in a manner that fluidically connects each identified channel to an adjacent channel. Then, a second image analysis of the image data is conducted in response to selectively removing the channel wall dead-ends to measure a length of each channel wall. Channels walls having a length greater than a threshold channel wall length value are selectively cut, thereby providing reduced fluid flow resistance throughout the FC.

Method of designing fluid flow field structure for fuel cell bipolar plate

A highly integrated power electronics embedded PCB-cold plate assembly includes a cold plate, a power electronics embedded printed circuit board (PCB), and a low thermal resistance dielectric layer sandwiched between the cold plate and the power electronics embedded PCB. The power electronics embedded PCB is bonded to the cold plate via the low thermal resistance dielectric layer to form highly integrated power electronics embedded PCB—cold plate assembly is formed. And in one example, the low thermal resistance dielectric layer sandwiched between and directly bonded to the cold plate and the power electronics embedded PCB.

Power device embedded printed circuit board-cold plate assemblies with low interfacial thermal and mechanical stresses and methods of making the same

A method includes printing, using a 3D printer, a cold plate, printing, using a 3D printer, an electrical insulation layer embedded in a top surface of the cold plate, and printing, using a 3D printer, a conductor substrate embedded in the electrical insulation layer embedded in the top surface of the cold plate.

3D printed cold plates and methods for cooling power devices embedded in 3D printed circuit boards

A power device embedded printed circuit board (PCB) assembly includes a cold plate, a multi-layer PCB with at least one power device embedded therein bonded to and in thermal communication with the cold plate, and a chemical vapor deposition (CVD) dielectric layer disposed between the cold plate and the multi-layer PCB. The CVD dielectric layer can be applied to the cold plate and a bonding layer can be sandwiched between the CVD dielectric layer and the multi-layer PCB with at least one power device assembly embedded therein. In the alternative, CVD dielectric layer can be applied top the multi-layer PCB with at least one power device assembly embedded therein and bonding layer can be sandwiched between the CVD dielectric layer and the cold plate.

Power device embedded printed circuit board assemblies with thin film dielectric layers

A 3D printing system includes a reservoir for a UV-curable dielectric material in communication with a first nozzle configured to print the UV-curable dielectric material onto a substrate and a reservoir for a low CTE filler in communication with a second nozzle configured to print the low CTE filler onto the substrate, and a reservoir for a conductive ink in communication with a third nozzle configured to print the conductive ink onto the substrate. The 3D printing system prints the UV-curable dielectric material and the low CTE filler such that the printed low CTE filler mixes with the printed UV-curable dielectric material and forms a UV-curable dielectric layer with the low CTE filler dispersed therein.

UV curable dielectric materials for 3D printing and 3D printing systems with the same

In one embodiment, an electronics assembly includes a cold plate assembly having a first surface, at least one power electronic device disposed within a recess on the first surface of the cold plate assembly, and a printed circuit board disposed on a surface of the at least one power electronic device. The printed circuit board includes a first insulation layer, a second insulation layer, an electrically conductive power layer between the first insulation layer and the second insulation layer, a first set of thermal vias extending from the electrically conductive power layer and toward the first surface of the cold plate assembly, and a second set of thermal vias extending from the first surface of the cold plate assembly toward the electrically conductive power layer. The first set of thermal vias is electrically isolated from the second set of thermal vias.

Electronics assemblies with power electronic devices and three-dimensionally printed circuit boards having reduced joule heating

System, methods, and other embodiments described herein relate to using a printed conductor and a rectifier in the same enclosure for transferring power. In one embodiment, an apparatus includes a conductor, printed on a substrate housed in an enclosure, that generates alternating current caused by a magnetic field emitted by a transmitter, wherein the conductor is a trace spanning layers. The apparatus also includes a rectifier, on a device housed in the enclosure, that receives the alternating current through a terminal connected with the conductor and converts the alternating current to a direct current for powering a load, wherein an insulator between the conductor and the rectifier isolates the magnetic field.

Printed conductor and rectifier package for power transfer

A power electronics assembly including a circuit board assembly including a plurality of electrically conductive logic layers, a plurality of electrically conductive power layers, and a laminate panel provided between the plurality of electrically conductive logic layers and the plurality of electrically conductive logic layers. The laminate panel includes a power electronics device assembly including a substrate and a power electronics device. The substrate includes a graphite layer and a metal layer encasing the graphite layer. A recess is formed in an outer surface of the metal layer. The power electronics device is bonded within the recess of the outer surface of the substrate. Each electrically conductive logic layer is provided at a first surface of the laminate panel, and each electrically conductive power layer is provided at a second surface of the laminate panel opposite the first surface of the laminate panel.

Power electronics assemblies having power electronics devices embedded within a flip chip

A bipolar plate for a fuel cell, a fuel cell, and a method of designing a bipolar plate for a fuel cell having a hybrid flow field structure that includes a plurality of parallel feed flow channels fluidically connected to an inlet bipolar plate region, a plurality of parallel exit flow channels fluidically connected to an outlet bipolar plate region, and an interwoven pattern formed by a plurality of simplified periodic array flow field structure generated based on flow patterns generated by homogenized anisotropic porous media optimization. The flow field structure enhances fuel cell performance by facilitating lower pressure drop via minimized fluid flow resistance, and removal of accumulated water in the oxygen channel and the gas diffusion layer (GDL) under the ribs of the bipolar plate.

Fuel cell bipolar plate flow field having hybrid interwoven channel pattern

In one embodiment, a power electronics assembly includes a power device assembly further including an S-cell. The S-cell includes a first metal layer having a recess, a graphite layer bonded to the first metal layer, a second metal layer bonded to the graphite layer, and a ceramic layer, wherein the ceramic layer has a first metalized surface and a second metalized surface, and the first metalized surface is bonded to the second metal layer by a solder layer. The power electronics assembly further includes a power device disposed within the recess of the first metal layer, and a cold plate, wherein the second metalized surface of the ceramic layer is bonded to a surface of the cold plate.

Power electronic device assemblies having an electrically insulating S-cell

Power electronics device assemblies, circuit board assemblies, and power electronics assemblies are disclosed. In one embodiment, a power electronics device assembly includes an S-cell including a first metal layer comprising a first surface having a recess, a first graphite layer bonded to the first metal layer, a second metal layer bonded to the first graphite layer, a solder layer disposed on the second metal layer, and an electrically insulating layer bonded to the solder layer. The power electronics device assembly may further include a power electronics device disposed within the recess of the first surface of the first metal layer.

Power electronic device assemblies having heat spreaders and electrically insulating layer

Cold plate assemblies, power electronics assemblies including the same, and power electronics systems including the same are disclosed. A cold plate includes an S-cell disposed within a cavity of the cold plate and at least one reactive multilayer system interposed between the S-cell and a base wall of the cavity.

Cold plates incorporating reactive multilayer systems and S-cells

Power electronics systems including power electronics device assemblies having cold plates are described. A cold plate includes an S-cell having a body with a graphite or graphite-composite material. The body defines a power device recess. The S-cell is disposed within a cavity of the cold plate. The cold plate further includes a bond material bonding the S-cell to a base wall of the cavity.

Cold plates incorporating S-cells

A method of forming integrated power electronics packages by 3D-printing the PCB on and around power devices includes bonding a power device to a first surface of a cold plate and printing, using a 3D-printer, a circuit board on and around the power devices such that the circuit board includes one or more insulating portions and one or more conductive portions.

Growing community of inventors

South Lyon, MI, United States of America

Feng Zhou