Changsha University of Science and Technology

National University of Defense Technology, People's Liberation Army of China

Feng Shi

Wei Li

Cong Mao

Kun Tang

Mingjun Zhang

Yongle Hu

Weidong Tang

Ci Song

Yinghui Ren

Yuanqiang Luo

Gang Wu

Ziyang Chen

Zhuo Wen

Guangqi Zhou

Ye Tian

Gang Zhou

Guipeng Tie

The invention provides an electrochemical discharge-assisted micro-grinding device for micro-components of brittle and hard materials. The device includes a micro-grinding tool, grinding fluid, a workpiece, an auxiliary electrode, a processing groove, and a pulsed DC power supply; the processing groove is filled with grinding fluid; the micro-grinding tool, the workpiece, and the auxiliary electrode are immersed in the grinding fluid; the micro-grinding tool is composed of a conductive grinding tool base, an electroplating layer, and insulated superabrasives. The micro-grinding tool is connected to the negative electrode of the pulsed DC power supply; the grinding fluid is composed of HO, NaCO, EDTA-Fe-Na, and deionized water; the workpiece material is brittle and hard; a large number of micro structures need to be produced on the surface of the workpiece.

Electrochemical discharge-assisted micro-grinding device for micro-components of brittle and hard materials

This paper describes an invention involving an electrochemical discharge-enabled micro-grinding process for micro-components of silicon-based materials. The specific machining method is described below. A micro-grinding tool and an auxiliary electrode are respectively connected to the negative and positive electrodes of a pulsed DC power supply. When the current flows through the loop, an electrochemical hydrogen evolution reaction (HER) occurs at the micro-grinding tool in the grinding fluid, which generate multiple hydrogen bubbles. The bubbles coalesce into an insulating gas film and separate the micro-grinding tool from the grinding fluid; when the critical voltage is reached, the gas film is broken down and an electrochemical discharge occurs accompanied by discharge spark; under the action of the discharge spark, the surface material of the workpiece in the discharge-affected region is directly ablated to generate a heat-affected layer (HAL), namely, physical modification.

Electrochemical discharge-enabled micro-grinding process for micro-components of silicon-based materials

The present disclosure provides a system and method for controlling a dynamically controllable ultrawide-amplitude and high-response ion source, including: resolving dwell time of ion beam machining during iterative machining; selecting an appropriate velocity V of a movable shaft of a machine tool according to a calculation result of the dwell time; and dynamically calculating process parameters of an ion source according to an initial surface error of an optical component and the velocity V of the movable shaft, and generating a corresponding numerical control (NC) program to machine the optical component. The present disclosure can control the removal function of the ion beam polishing in real time, improve the precision and efficiency of the ion beam polishing, and further reduce the requirement on a movement system of the machine tool and the depth of a damaged layer.

Method for controlling dynamically controllable ultrawide-amplitude and high-response ion source

Growing community of inventors

Hunan, China

Feng Shi