Semiconductor Manufacturing International (Shanghai) Corporation

Semiconductor Manufacturing International (Beijing) Corporation

Feng Qiu

Hu Wang

Shan Shan Wang

Wei Hu Zhang

A semiconductor device includes a substrate; a gate structure, located over the substrate, the gate structure including a first gate oxide layer, a second gate oxide layer, and a silicon layer. The first gate oxide layer is over the substrate, and the first gate oxide layer has a sloped sidewall on one side and a vertical sidewall on another side. The second gate oxide layer is over the substrate and on the sloped sidewall of the first gate oxide layer, and a thickness of the second gate oxide layer is less than a thickness of the first gate oxide layer. The silicon layer is formed over the first gate oxide layer and the second gate oxide layer.

Semiconductor device

A method for forming a semiconductor device includes providing a substrate, forming an oxide layer over the substrate, forming a plurality of first gate oxide layers by etching the oxide layer, forming a second gate oxide layer between adjacent first gate oxide layers, forming a silicon layer over the plurality of first gate oxide layers and the second gate oxide layer, and etching the plurality of first gate oxide layers, the silicon layer, and the second gate oxide layer to expose the substrate, thereby forming a plurality of gate structures. The first gate oxide layer of the plurality of first gate oxide layers has sloped sidewalls. A thickness of the second gate oxide layer is less than a thickness of the first gate oxide layer. Each gate structure includes an etched first oxide layer, a portion of the second gate oxide layer, and a portion of the silicon layer.

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Shanghai, China

Feng Qiu