Shanghai Tianma Micro-electronics Co., Ltd.

Shanghai Avic Opto Electronics Co., Ltd.

Chengdu Tianma Micro-electronics Co., Ltd.

Tianma Micro-electronics Co., Ltd.

Tianma Advanced Display Technology Institute (xiamen) Co., Ltd.

Shanghai Tianma Am-oled Co., Ltd.

Feng Qin

Kerui Xi

Tingting Cui

Jine Liu

Xuhui Peng

Baiquan Lin

Zhenyu Jia

Xiaohe Li

Xiangjian Kong

Jie Zhang

Zhiqiang Xia

Qiongqin Mao

Qinyi Duan

Mingwei Zhang

Wei Zhang

Ming Hsi Wang

Jian Zhao

Dongliang Dun

Ling Shen

Shoufu Jian

Yingteng Zhai

Linzhi Wang

Zuocai Yang

Ping Su

Lu Yao

Jiubin Zhou

Huijun Jin

Huan Li

Yuan Yuan Ding

Dandan Qin

Junting Ouyang

Tinghai Wang

Zhen Liu

Kaidi Zhang

Yunfei Bai

Zhidan Su

Xiaonan Han

Dengming Lei

Boquan Lin

Yian Zhou

Huihui Jiang

Qingsan Zhu

Wanchun Du

Yajie Wang

Guicai Wang

Xingyao Zhou

Qijun Yao

Yi Bin Wang

Feng Lu

Yang Zeng

Chen Xiao Wang

Fei Li

Yi Wang

Xin Xu

Quanpeng Yu

Jing Wang

Xupeng Wang

Yuantao Wu

Donghua Wang

Chunmei Gao

Qiang Jia

Lingling Zhang

Ming Xie

Liping Zhang

Yifan Xing

Zuzhao Xu

Yongli Qian

Mingyu Wang

Fan Xu

Zhiqi Chen

Benshun Zhong

Liyan Li

Jin'e Liu

Jiaren Wang

Tianyi Wu

Xiaoxiang He

Xiaobing Zhao

Danping Wang

Luning Yang

Gang Qi

A display panel and a display device are provided, The display panel includes: a circuit layer, a light-emitting device layer located at a side of the circuit layer and including vertical light-emitting diodes; and a touch structure. A part of the touch structure is located between the light-emitting device layer and the circuit layer, and/or a part of the touch structure is located at a side of the light-emitting device layer away from the circuit layer.

Display panel and display device

A display apparatus includes a display panel and sweep signal lines. In an embodiment, the display panel includes light-emitting elements and pixel circuits. In an embodiment, at least one of the pixel circuits includes a pulse width modulation (PWM) module configured to control light emission duration of the light-emitting element. In an embodiment, the sweep signal lines are configured to provide a sweep signal to the PWM module. In an embodiment, the sweep signal lines include first sweep signal lines extending in a first direction, and at least two of the first sweep signal lines are connected through a first connection line extending in a second direction that intersects the first direction.

Display apparatus

A prefabricated substrate, a flexible substrate, a flexible module and a fabrication method, and a display device are provided. The prefabricated substrate includes a first film layer as a rigid film layer, and a second film layer as a flexible film layer. The second film layer at least partially wraps the first film layer. The first film layer includes a first surface and a second surface. The second film layer at least includes a first portion located on a side of the first surface away from the second surface, and a second portion and a third portion located on a side of the second surface away from the first surface. The second portion and the third portion are attached on the second surface through a first adhesive layer and a second adhesive layer, respectively. The second portion and the third portion are spaced apart by a gap.

Prefabricated substrate, flexible substrate, flexible module, fabrication method, and display device

A driving circuit, a driving method and a microfluidic substrate are provided. The driving circuit includes a first switching unit, a second switching unit, a reset unit, a first capacitor, and a second capacitor. In a first stage of a driving process of the driving circuit, the first switching unit is turned on, a first voltage signal is transmitted to a first node, the second switching unit is turned on, a second voltage signal is input to an output terminal of the driving circuit, and the driving circuit outputs an AC signal. In a second stage of the driving process, the first switching unit is turned off, the valid signal output by the second scan signal terminal controls the reset unit to be turned on, a third voltage signal is input to the output terminal of the driving circuit for reset, and the driving circuit outputs a DC signal.

Driving circuit, driving method and microfluidic substrate

A display panel and a display device are provided. The display panel includes: a pixel circuit, a light-emitting element and an initialization signal line. The initialization signal includes an enabling level and a non-enabling level, and the enabling level of the initialization signal is configured to initialize a target node of the pixel circuit. The initialization signal line extends in a first direction, and includes a first initialization signal line and a second initialization signal line. The pixel circuit includes a first pixel circuit connected to the first initialization signal line and a second pixel circuit connected to the second initialization signal. A screen refresh cycle of the display panel includes a first stage, the first initialization signal line transmits the enabling level, and the second initialization signal line transmits the non-enabling level, in the first stage.

Provided are a display panel and a display device. The display panel includes a pixel circuit and a light-emitting element. The pixel circuit includes a data write module, a drive module and a first reset module. The data write module is configured to transmit a data signal in response to a scan signal of a first scan terminal. The drive module is configured to provide a drive current for the light-emitting element and includes a drive transistor. The drive transistor is configured to generate the drive current according to the data signal. The first reset module is connected between a first signal line and a gate of the drive transistor and configured to transmit a signal of the first signal line to the gate of the drive transistor. The data write module is connected between the first signal line and an input terminal of the drive transistor.

A detection device and a detection method are provided. The detection device includes at least one detection unit. The detection unit includes a first transistor, a second transistor, a third transistor and a fourth transistor that are electrically connected to each other, a gate is disposed above a channel of each of the first transistor, the second transistor, and the third transistor, and an ion-sensitive membrane is covered above a channel of the fourth transistor. The detection device also includes a first voltage signal terminal, a second voltage signal terminal, and a third voltage signal terminal. Further, the detection device includes a first power supply terminal, a first potential output terminal, a second potential output terminal, and a second power supply terminal.

Detection device and detection method

Provided are a phase shifter, a preparation method thereof, and an antenna. The phase shifter includes at least one phase shifting unit, and the phase shifting unit includes a microstrip line, a photo-dielectric layer, a ground electrode, and at least one light guiding structure; the microstrip line is located on a side of the photo-dielectric layer, and the ground electrode is located on a side of the photo-dielectric layer facing away from the microstrip line; the light-guiding structure at least partially overlaps the photo-dielectric layer, and the light-guiding structure is configured to guide light into the photo-dielectric layer.

Antenna including at least one microstrip line phase shifting unit having a photo-dielectric layer and a light guiding structure configured to guide light into the photo-dielectric layer

The present disclosure provides chip package structure, packaging method, camera module and electronic equipment. The package structure includes chip package module, which includes light-transmitting substrate, wiring layer located on side of light-transmitting substrate and including first metal wire, conductor located on side of wiring layer facing away from light-transmitting substrate, photosensitive chip located on side of wiring layer facing away from the light-transmitting substrate, active chip located on side of wiring layer facing away from light-transmitting substrate, and plastic encapsulation layer encapsulating photosensitive chip and active chip. The conductor includes first end electrically connected to first metal wire, and second end. The photosensitive chip includes pin electrically connected to first metal wire and has photosensitive surface facing towards light-transmitting substrate. The photosensitive surface includes photosensitive region that is not overlapping first metal wire. The active chip includes pin electrically connected to first metal wire.

Package structure, packaging method, camera module, and electronic equipment

Provided are a liquid crystal antenna and a manufacturing method thereof. The liquid crystal antenna includes a first substrate, a second substrate and a third substrate that are stacked. The first substrate and the second substrate constitute a first box-shaped structure. A first space is disposed between the first substrate and the second substrate. The first space is filled with a liquid crystal layer. The second substrate and the third substrate constitute a second box-shaped structure. A second conductive pattern layer is disposed on a side of the second substrate. A third conductive pattern layer is disposed on a single side of the third substrate. A second space is disposed between the second substrate and the third substrate.

Liquid crystal antenna and manufacturing method therefor

A substrate module, a display apparatus, and a liquid crystal antenna are provided in the present disclosure. The substrate module includes a first substrate. The first substrate includes a first sub-region and a second sub-region; the second sub-region includes a binding region; and the binding region includes first pins. The first sub-region includes first loads, and a first sub-pin is electrically connected to the first load. The second sub-region includes at least one second load, and a second sub-pin is electrically connected to the second load. The second load includes a capacitor including a first capacitor. The first substrate includes a first base substrate, a first electrode layer, a first insulating layer and a second electrode layer. Along a direction perpendicular to a plane of the base substrate, an overlapping portion of a first electrode portion and a second electrode portion forms the first capacitor.

Substrate module, display apparatus, and liquid crystal antenna

A light-emitting module includes a light-emitting panel which includes a first rigid substrate, a flexible substrate, a circuit layer, a light-emitting element, and a driver chip. The flexible substrate includes a light-emitting region, a bending region, and an epitaxial region, and the light-emitting region and the epitaxial region are located on two ends of the bending region. The circuit layer includes a first connection terminal located on the epitaxial region and the driver chip is bonded to the first connection terminal. The light-emitting element is located on the light-emitting region, and the light-emitting element emits light toward the first rigid substrate. The flexible substrate is bent in the bending region and the flexible substrate in the epitaxial region is bent to a side of the light-emitting elements facing away from the first rigid substrate. The process difficulty can be reduced and the product yield can be improved.

Light-emitting module comprising plurality of light emitting diodes and epitaxial region and manufacturing method thereof and display device

A semiconductor package includes a semiconductor element, a wiring structure, an encapsulation structure, and a solder ball. The semiconductor element includes a plurality of pins. A side of the wiring structure is electrically connected to the plurality of pins of the semiconductor element. The wiring structure includes at least two first wiring layers. A first insulating layer is disposed between adjacent two first wiring layers of the at least two first wiring layers. The first insulating layer includes a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The encapsulation structure at least partially surrounds the semiconductor element. The solder ball is located on a side of the wiring structure away from the semiconductor element. The solder ball is electrically connected to the at least two first wiring layers.

Semiconductor package having a semiconductor element and a wiring structure

A chip package structure, manufacturing method thereof, and module are described. In an embodiment, the chip package structure includes: a substrate, a wiring layer, a chip, and a second conductive bump, wherein, in an embodiment, the substrate includes a first region and a second region surrounding the first region, and the wiring layer is located on side of the substrate and includes metal wire, wherein at least part of a metal wire is in contact with the substrate in direction perpendicular to the substrate, and the metal wire overlaps with the second region, wherein the chip is located on side of the wiring layer facing away from the substrate, and the chip corresponds to the first region. In an embodiment, a first conductive bump is provided on side of the chip facing away from the substrate and is electrically connected to the metal wire.

Chip package structure and method for manufacturing the same, and module

A liquid crystal antenna and a method for forming a liquid crystal antenna are provided. The liquid crystal antenna includes a first substrate; a second substrate opposite to the first substrate; and a liquid crystal layer disposed between the first substrate and the second substrate. A first conductive layer is disposed on a side of the first substrate facing toward the second substrate; a second conductive layer is disposed on a side of the second substrate facing toward the first substrate; the second conductive layer at least includes a plurality of radiation electrodes; an external metal layer is disposed on a side of the first substrate facing away from the liquid crystal layer; and the external metal layer is connected to a fixed potential.

Liquid crystal antena and fabrication thereof

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Shanghai, China

Feng Qin