Industrial Technology Research Institute

Iteq Corporation

Feng-Po Tseng

Kuo-Chan Chiou

Kuei-Yi Chuang

Lu-Shih Liao

Tzong-Ming Lee

Jing-Pin Pan

Jung-Mu Hsu

Jia-Chi Huang

Wen-Pin Ting

Tzu-Ting Lin

A reversible crosslinking reactant composition is provided. The composition includes at least one furan-group-containing oligomer and a bismaleimide compound having a structure represented by Formula (II) wherein the furan-group-containing oligomer is an oligomer having a structure represented by Formula (IV), an oligomer having a structure represented by Formula (V), or an oligomer having a first repeating unit and a second repeating unit, wherein the first repeating unit has a structure represented by Formula (VI), the second repeating unit has a structure represented by Formula (VII), wherein R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, R, q, z and E are as defined in specification.

Reversible crosslinking reactant composition

The invention provides a furan-modified compound or oligomer. The compound has a structure represented by Formula I:  When formula I represents a compound, x is an integer of 1&#x2dc;5; A including a group formed of ketone, amido, imide, imido, phenyl ether or enol ether group; G is a direct bond, &#x2014;O&#x2014;, &#x2014;N&#x2014;, &#x2014;Ar&#x2014;NH&#x2014;(CH)&#x2014;, &#x2014;Ar&#x2014;O&#x2014;(CH)&#x2014;, &#x2014;Ar&#x2014;O&#x2014;(CH)&#x2014;NH&#x2014;(CH)&#x2014;, &#x2014;(CH)&#x2014;NH&#x2014;(CH)&#x2014;, &#x2014;(CH)&#x2014;O&#x2014;(CH)&#x2014; or &#x2014;(CH)&#x2014;CH(OH)&#x2014;(CH)&#x2014;NH&#x2014;; Ar is substituted or unsubstituted arylene group; a is an integer of 1 to 5; and b is an integer of 0 to 5.

Furan-modified compound and oligomer

A reversible crosslinking reactant composition is provided. The composition includes at least one furan-group-containing oligomer having a structure represented by Formula (I) and a bismaleimide compound having a structure represented by Formula (II), wherein the equivalent ratio of the furan group of the furan-group-containing oligomer having a structure represented by Formula (I) to the maleimide group of the bismaleimide compound having a structure represented by Formula (II) is from 0.5:1 to 1:0.5.

A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is in which Ris &#x2014;CH&#x2014;, &#x2014;C(&#x2550;O)&#x2014;, or &#x2014;(CH)&#x2014;(CH)&#x2014;, and Ris H or CH.

Thermally conductive resin, resin composition, prepreg, and copper clad laminate

A polymer is provided. The polymer includes a first repeating unit represented by Formula (I) and a second repeating unit represented by Formula (II): wherein Yand Yare independently &#x2014;H, &#x2014;CH, or &#x2014;CHCH; n is an integer ranging from 1 to 25; and the molar ratio of the first repeating unit to the second repeating unit is from 5:95 to 15:45. A resin composition including the aforementioned polymer is also provided.

Polymers and resin composition employing the same

A resin formulation is provided. The resin formulation includes carboxy anhydride at 100 parts by weight, first diisocyanate having the following formula (I) at 20-90 parts by weight, second diisocyanate having the following formulas (II), (III) or a combination thereof at 45-103 parts by weight, and bismaleimide (BMI) at 50-200 parts by weight. A resin polymer and a composite material including the resin polymer are also provided.  In formulas (I), (II) and (III), A includes benzene or cyclohexane, Q includes C1-C12 alkylene, &#x2014;O&#x2014;, &#x2014;S&#x2014; or &#x2014;SO&#x2014;, X includes &#x2014;H, &#x2014;CHor &#x2014;CHCH, Rincludes &#x2014;H, &#x2014;CHor &#x2014;CHCH, and E includes &#x2014;H, &#x2014;CHor &#x2014;CHCH.

Resin formulations, resin polymers and composite materials comprising the resin polymers

A modified bismaleimide resin of Formula (I) or (II) is provided.  In Formula (I) or (II), Q is &#x2014;CH&#x2014;, &#x2014;C(CH)&#x2014;, &#x2014;O&#x2014;, &#x2014;S&#x2014;, &#x2014;SO&#x2014; or null, R is &#x2014;(CH)&#x2014;, &#x2014;(CH)&#x2014;, &#x2014;(CH)&#x2014;, &#x2014;(CH)&#x2014;, &#x2014;CH&#x2014;C(CH)&#x2014;CH&#x2014;CH(CH)&#x2014;CH&#x2014;CH&#x2014;, 10&#x3c;n&#x3c;500, and x+y=n. The invention also provides a method for preparing a modified bismaleimide resin and a composition including the modified bismaleimide resin.

Modified bismaleimide resins, preparation method thereof and compositions comprising the same

The invention provides a halogen-free and thermal resistant composition, including a mixture of bismaleimide and maleimide with molar ratio of 99:1-50:50; a barbituric acid, wherein the molar ratio of the mixture and the barbituric acid is 93:7-80:20; and an epoxy resin, wherein (the mixture with the barbituric acid) and the epoxy resin have a weight ratio of 5:95 to 50:50. The mixture undergoes reaction at 110-130&#xb0; C. for about 2&#x2dc;7 hours to form a maleimide modified epoxy resin. The procedure of forming the composition is solvent-free, thereby providing improved integrity for electronic packaging, lower curing temperature, and a simplified process.

Halogen-free and thermal resistant composition

A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.

Growing community of inventors

Taoyuan, Taiwan

Feng-Po Tseng