Powerchip Semiconductor Corporation

Feng-Ming Kuo

Long-Hui Lin

Su-Fen Cheng

First, a wafer with a plurality of defects generated in a first semiconductor process is provided. A defect inspection is performed to detect the defects on the wafer. Then, an automatic defect classification is performed according to a predetermined defect database having a defect classification recipe generated from a second semiconductor process. After that, a verifying process is further performed by comparing the result of the automatic defect classification with that of a manual defect classification to verify the accuracy of the automatic defect classification.

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Tao-Yuan Hsien, Taiwan

Feng-Ming Kuo