Inventec Corp.

Inventec (pudong) Technology Corporation

Feng-Ku Wang

Chih-Kai Yang

Yi-Lun Cheng

Chun-Lung Lin

Ting-Chiang Huang

Sheng-Jie Syu

Shaw-Fuu Wang

Yu-Chih Cheng

Chun-Yi Chang

Wei-Yi Lin

Jui-Chan Fan

Huang-Cheng Ke

Chun-Chi Lin

Ming-Hung Lin

Chia-Cheng Shih

Lung-Hsun Song

Li-Ting Wang

Hua-Feng Chen

Po-Hsuan Chen

Der-Jang Sun

Kuang-Chung Sun

Cheng-Shang Chou

Cheng-Shi Liu

Wei-Hsin Wu

Electronic apparatus includes a display component, a base, a moveable case, and a transmission component. The display component includes a rotational shaft. The base is pivotally connected to the rotational shaft. The base has an opening. The moveable case is pivotally connected to the base. The moveable case can selectively cover or uncover the opening. The transmission component is disposed on the base. The transmission component is operatively connected between the rotational shaft and the moveable case. When the display component is rotated away from the base, the rotational shaft actuates the moveable case to rotate to uncover the opening through the transmission component. When the display component is rotated toward the base, the rotational shaft actuates the moveable case to rotate to cover the opening through the transmission component.

Electronic apparatus

A computer device with at least one heat-dissipation channel includes a master unit and a peripheral unit. A case of the master unit includes a first connection surface including a first hole. The first hole communicates to an external space through a first heat-dissipation channel inside the master unit. A case of the peripheral unit includes a second connection surface including a second hole. The second hole communicates to the external space through a second heat-dissipation channel. A fan is located inside the second peripheral unit channel. When the first connection surface and the second connection surface are aligned to connect with each other, the first heat-dissipation channel, the first hole, the second hole and the second heat-dissipation channel are sequentially communicated in space to form an integrated heat-dissipation channel for guiding a cooling airflow driven by the fan to pass therethrough.

Computer device with heat-dissipation channels

An electronic device comprises a casing, a heat generation source, an airflow guiding structure, and a jet flow generator. The casing includes an interior space. The airflow guiding structure is in contact with the heat generation source and has one air inlet. The jet flow generator, the heat generation source, and the airflow guiding structure together are situated within the interior space. The jet flow generator includes a nozzle which directs toward the air inlet of the airflow guiding structure at a distance apart. Airflows emitted by the jet flow generator through the nozzle travel at a velocity greater than 0.1 meters/second (m/s), causing a fluid pressure differential with the neighboring air and pulling air in the vicinity along the air inlet into the airflow guiding structure.

Electronic device including a jet flow generator

An electronic device comprises a case having an air ventilation hole and an opening, a heat source, a radiator disposed inside the case and in thermal contact with the heat source, and an air current generator. The radiator comprises a body having a first and second lateral sides, and a third lateral side disposed therebetween. A first air inlet is disposed on the first lateral side. An air outlet exposed by the opening is disposed on the second lateral side, and a second air inlet is disposed on the third lateral side. The body comprising fins and a geometrical middle side of the fins is between the first and second lateral sides. The second air inlet corresponding to the air ventilation hole is between the geometrical middle side and the first lateral side. An air exhausting hole of the air current generator faces the first air inlet.

Electronic device

An electronic device includes a case, a heat source, a radiator, and an air stream generator. The case has an air ventilation hole and an opening. The radiator is disposed in the case and in thermal contact with the heat source. The radiator includes a main body having a first, a second, and a third side surface. A first air inlet, an air outlet, and a second air inlet are disposed on the first side surface, the second side surface, and the third side surface, respectively. The third side surface and the case are separated by a distance from each other. The second air inlet is disposed between a geometric middle plane of fins of the main body and the second side surface. The distance between the second air inlet and the first side surface is greater than that between the air ventilation hole and the first side surface.

The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Electronic device and heat dissipation module thereof

A method for testing heat pipes includes the following steps. A plurality of bar-shaped heat pipes having the same size is provided, and the heat pipes are deformed. The deformed heat pipes are placed in a temperature regulator, such that a temperature of the heat pipes is periodically changed between a first temperature and a second temperature. The heat pipes are then taken out of the temperature regulator. One end of each heat pipe is maintained at a third temperature by a thermostatic device, and a heat pipe temperature difference of two opposite ends of the heat pipe is measured. The heat pipes having the heat pipe temperature difference greater than a standard temperature difference in the heat pipes are marked.

Method for testing heat pipes

An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.

Electronic apparatus with improved heat dissipation

A mobile computing apparatus includes a shell, a circuit board, a first heat-dissipation module, a centrifugal fan for exhaust, and a centrifugal fan for convection. The shell has a first through hole. The circuit board is disposed on the shell, and has a first heat-generation device. The first heat-dissipation module has a first heat-absorption end and a first heat-dissipation end, and the first heat-absorption end thermally contacts with the first heat-generation device. The centrifugal fan for exhaust has a first gas outlet, and the first heat-dissipation end is located between the first gas outlet and the first through hole, so that the centrifugal fan for exhaust exhausts to an outside of the shell. The centrifugal fan for convection is configured in the shell, and exhausts to an inside of the shell. Therefore, gas flow circulation occurs in the shell, so that the mobile computing apparatus has a desirable heat-dissipation effect.

Mobile computing apparatus

A corresponding relation between heat resistance values of first heat dissipation modules under a non-uniform heat source and heat resistance values of the first heat dissipation modules under a uniform heat source is described through a linear equation. Therefore, before second heat dissipation modules are tested, a calculation is performed with the linear equation, such that a target heat resistance value of the first heat dissipation modules arranged on the non-uniform heat source is corresponding to a standard heat resistance value of the first heat dissipation modules arranged on the uniform heat source. Afterwards, it is predicted whether the second heat dissipation modules arranged on the non-uniform heat source satisfy a test standard or not by using a test heat resistance value acquired by testing the second heat dissipation modules arranged on the uniform heat source.

Method for detecting performances of heat dissipation modules

An electronic device is provided. The electronic device includes a mechanism, a circuit module and a fixing element. The circuit module is disposed inside the mechanism. The circuit module includes a circuit board and a fan. The circuit board has at least one edge and a fixing hole. The fan has a first lateral side and a second lateral side. The first lateral side has a first hook buckled on the edge. The second lateral side has at least one screwed board, wherein the screwed board has a screwed hole. The fixing element is screwed on the screwed hole and the fixing hole to screw the fan on the circuit board.

Circuit module and electronic device using the same

A method for estimating a fan life includes the following steps. Fans to be checked at a number of M are provided. A working temperature and a test temperature of a fan are set, and the test temperature is greater than the working temperature. An acceleration factor is set, which has a fixed value. The fans are kept in an operating state at the test temperature, and a number of the damaged fans is detected and recorded at intervals of a check time, until N damaged fans are detected. A distribution of time points when the fans are damaged is simulated with a Weibull distribution model, and a shape parameter and a characteristic life of the Weibull distribution model are calculated. A life value of the fans at the test temperature is calculated. A life value of the fans at the working temperature is calculated by using the acceleration factor.

Method for estimating fan life

A method for simulating a thermal resistance value of a thermal test die is provided to estimate a relationship between the thermal resistance value of a heating block and the thermal resistance value of the thermal test die, and to find out a size of the heating block that matches an actual thermal situation of the thermal test die. In addition, after being tested by the heating block, the reliability of the testing result may be improved by verifying whether the relationship of a transient response of thermal resistance of the heating block and a steady-state response of thermal resistance of the thermal test die is within a range of a setting variation.

Method for simulating thermal resistance value of thermal test die

A heat dissipation module for being assembled to a circuit board with a first heat-generating element and a second heat-generating element is provided. A heat generation rate of the first heat-generating element is higher than that of the second heat-generating element. The heat dissipation module includes a heat-transferring connection element, a cooling device, a first heat-transferring plate and a second heat-transferring plate. The heat-transferring connection element has a first part and a second part. The cooling device connects to the first part. The first heat-transferring plate is connected between the first heat-generating element and the second part. The second heat-transferring plate has a third part and a fourth part. The second part is connected between the first heat-transferring plate and the third part. The fourth part is connected to the second heat-generating element. The thermal conductivity of the first heat-transferring plate is higher than that of the second heat-transferring plate.

Heat dissipation module

A heat sink is used for dissipating thermal energy generated by an electronic component of an electronic device. The heat sink includes a contact base and a fin base. The contact base is attached on the electronic component to transfer thermal energy, and the fin base is pivotally connected to the contact base to transfer thermal energy with the contact base. The fin base has a plurality of fins, and rotates relative to the contact base. A center of gravity of the fin base deviates from a rotation axis. When the electronic device is moved, due to the deviated center of gravity, the fin base rotates to make the fins disturb the air inside the electronic device.

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Taipei, Taiwan

Feng-Ku Wang