Siliconware Precision Industries Co., Ltd.

Feng Kao

Lung-Yuan Wang

Mao-Hua Yeh

An electronic package is provided, in which an electronic structure used as an integrated voltage regulator and a plurality of conductive pillars are embedded in an encapsulating layer to facilitate electrical transmission with electronic components at a close range.

Electronic structure

An electronic package is provided, in which an electronic element that is electrically connected to a plurality of conductive vias and a functional part that has a hollow area are disposed on a photonic die that has the plurality of conductive vias and at least one external connection portion, where a cladding layer covers the electronic element and the functional part, such that the external connection portion is exposed from the hollow area and the cladding layer for an optical fiber to insert into the hollow area and connect to the external connection portion, so as to achieve the purpose of optoelectronic integration.

Electronic package and manufacturing method thereof

An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.

Electronic package including electronic structure and electronic body and manufacturing method thereof

An electronic package and a method for fabricating the same are provided. Two packaging modules are stacked on each other. An area that an electronic package occupies a mother board is reduced during a subsequent process of fabricating an electronic product. Therefore, the electronic product has a reduced size.

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Taichung, Taiwan

Feng Kao